H05K 2201/0355
Metal foils
H05K2201/0355 (Metal foils) appears on 1,686 US grants and 1,428 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,686
- Published applications
- 1,428
- Assignees
- 589
- Inventors
- 3,154
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 14 | 0 |
| 1977 | 8 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 9 | 0 |
| 1981 | 6 | 0 |
| 1982 | 12 | 0 |
| 1983 | 16 | 0 |
| 1984 | 14 | 0 |
| 1985 | 23 | 0 |
| 1986 | 16 | 0 |
| 1987 | 16 | 0 |
| 1988 | 19 | 0 |
| 1989 | 26 | 0 |
| 1990 | 30 | 0 |
| 1991 | 32 | 0 |
| 1992 | 40 | 0 |
| 1993 | 29 | 0 |
| 1994 | 31 | 0 |
| 1995 | 39 | 0 |
| 1996 | 32 | 0 |
| 1997 | 27 | 0 |
| 1998 | 48 | 0 |
| 1999 | 50 | 0 |
| 2000 | 46 | 0 |
| 2001 | 57 | 43 |
| 2002 | 68 | 95 |
| 2003 | 73 | 79 |
| 2004 | 76 | 101 |
| 2005 | 58 | 83 |
| 2006 | 58 | 95 |
| 2007 | 37 | 88 |
| 2008 | 36 | 94 |
| 2009 | 42 | 97 |
| 2010 | 59 | 90 |
| 2011 | 55 | 72 |
| 2012 | 63 | 52 |
| 2013 | 55 | 32 |
| 2014 | 42 | 35 |
| 2015 | 28 | 45 |
| 2016 | 29 | 42 |
| 2017 | 31 | 29 |
| 2018 | 31 | 26 |
| 2019 | 33 | 28 |
| 2020 | 31 | 31 |
| 2021 | 26 | 37 |
| 2022 | 27 | 28 |
| 2023 | 21 | 38 |
| 2024 | 28 | 33 |
| 2025 | 19 | 23 |
| 2026 | 16 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Double layered electrolytic copper foil and manufacturing method thereof6 Oct 2026US 12,753,524 B2Volta Energy Solutions S.A.R.L.
- Curable compositions29 Sep 2026US 12,747,343 B2AGC Multi Material America, Inc.
- Electronic device29 Sep 2026US 12,750,946 B2Kmw Inc.
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Circuit board and method of manufacturing the same16 Jun 2026US 12,660,093 B2LG Innotek Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Resin composition, prepreg, layered sheet, printed circuit board, and semiconductor package17 Sep 2026US 2026/0282221 A1Resonac Corporation
- Printed circuit board and preparation method thereof, and electronic communication device20 Aug 2026US 2026/0247524 A1Huawei Technologies Co., Ltd.
- Resin film, metal-clad laminate, printed wiring board, and method for producing resin film13 Aug 2026US 2026/0233497 A1The University of Osaka
- Copper-ceramic substrate with an upper face which can be sintered13 Aug 2026US 2026/0240018 A1Heraeus Electronics GmbH & Co. KG
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Passive interposer including at least one passive electronic component225US 5,530,288 AInternational Business Machines Corporation · 1996