Copper-ceramic substrate with an upper face which can be sintered
AssigneeHeraeus Electronics GmbH & Co. KG
InventorsTamira STEGMANN, Sven THOMAS
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Abstract
A copper-ceramic substrate, the use of a copper-ceramic substrate, and a method for producing a bonded connection between a copper-ceramic substrate and an electronic component. The copper-ceramic substrate comprises: a) a ceramic body; and b) a copper layer which is connected to the ceramic body in a planar manner, wherein the copper layer has an upper face, and an energy spectrum, which is obtained by means of X-ray photoelectron spectroscopy during analysis of the upper face of the copper layer, exhibits a signal which comprises at least one peak P1 with a maximum ranging from 933.2 eV-934.0 eV.
Claims7
A copper-ceramic substrate comprising:
- a) a ceramic body;
- and
- b) a copper layer which is connected to the ceramic body in a planar manner, wherein the copper layer has an upper face, wherein an energy spectrum, which is obtained by means of X-ray photoelectron spectroscopy during analysis of the upper face of the copper layer, exhibits a signal which comprises at least one peak P1 with a maximum ranging from 933.2 eV-934.0 eV.
Dependencies are inferred from the claim text.