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AssigneeInternational Business Machines Corporation
InventorsChi S. Chang, Joseph G. Hoffarth, Voya R. Markovich, Keith A. Snyder, John P. Wiley
Estimating the term…
A multilayered circuit board assembly which includes a plurality of layered subassemblies each having electrically conducting wiring and at least one through hole therein. A first of these subassemblies possesses a greater wiring dnesity than the others while a second subassembly possesses a lesser resistance (and wiring density) than the others. In one example, several (e.g. at least four) such layered subassemblies may be included in the overall assembly such that those layers located along one side of the board may possess substantially greater wiring densities than the layers on the other side of the board while those layers on said other side will in turn possess lesser resistance (and greater current capacities). There are also described at least three methods for making the above multilayered circuit board assembly. Such a structure may be utilized in supercomputer applications.
In a multilayered circuit board assembly including first, second and third layered subassemblies arranged in a serially contiguous manner, each of said subassemblies having at least one dielectric layer, electrically conducting wiring in the form of at least one conductive layer and at least one through hole therein, each of said subassemblies further including a predetermined wiring density and an electrical current resistance, the improvement wherein said wiring densities and said electrical current resistances of said subassemblies progressively decrease from said first subassembly to said third subassembly.
A method of making a multilayered circuit board assembly including at least three layered subassemblies, each of said layered subassemblies having at least one dielectric layer, electrically conducting wiring in the form of at least one conductive layer and at least one through hole therein, each of said layered subassemblies including a predetermined wiring density and electrical current resistance, said method comprising the steps of:
A method of making a multilayered circuit board assembly including at least three layered subassemblies, each of said layered subassemblies having at least one dielectric layer, electrically conducting wiring in the form of at least one conductive layer and at least one through hole therein, each of said layered subassemblies including a predetermined wiring density and electrical current resistance, said method comprising the steps of:
Dependencies are inferred from the claim text.