H05K 2201/0361
Etched tri-metal structure, i.e. metal layers or metal patterns on both sides
Official title: Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
H05K2201/0361 (Etched tri-metal structure, i.e. metal layers or metal patterns on both sides) appears on 87 US grants and 68 published applications in this corpus.
Search patents in H05K- Granted patents
- 87
- Published applications
- 68
- Assignees
- 39
- Inventors
- 154
- Latest grant
- 7 Jan 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 8 |
| 2002 | 14 | 8 |
| 2003 | 8 | 6 |
| 2004 | 6 | 4 |
| 2005 | 5 | 3 |
| 2006 | 3 | 3 |
| 2007 | 5 | 3 |
| 2008 | 3 | 7 |
| 2009 | 2 | 8 |
| 2010 | 2 | 3 |
| 2011 | 5 | 0 |
| 2012 | 3 | 1 |
| 2013 | 1 | 1 |
| 2014 | 1 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 3 | 3 |
| 2019 | 0 | 0 |
| 2020 | 1 | 1 |
| 2021 | 2 | 3 |
| 2022 | 1 | 0 |
| 2023 | 1 | 2 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Circuit board7 Jan 2025US 12,193,152 B2LG Innotek Co., Ltd.
- Ultra-thin copper foil, ultra-thin copper foil with carrier, and method for manufacturing printed wiring board7 Feb 2023US 11,576,267 B2Mitsui Mining & Smelting Co., Ltd.
- Printed wiring board and method for manufacturing the same8 Mar 2022US 11,272,614 B2Ibiden Co., Ltd.
- Base material for printed circuit board and printed circuit board18 May 2021US 11,013,113 B2Sumitomo Electric Industries, Ltd.
- Module and method of manufacturing module23 Mar 2021US 10,958,860 B2Canon Kabushiki Kaisha
- Circuit board20 Mar 2025US 2025/0098059 A1LG Innotek Co., Ltd.
- Circuit board22 Jun 2023US 2023/0199944 A1LG Innotek Co., Ltd.
- Etchant for etching triple layer metal wiring structures of molybdenum/copper/molybdenum or molybdenum alloy/copper/molybdenum, and application thereof23 Feb 2023US 2023/0055735 A1Tcl China Star Optoelectronics Technology Co., Ltd.
- Printed wiring board and method for manufacturing the same6 May 2021US 2021/0136914 A1Ibiden Co., Ltd.
- Ultra-thin copper foil, ultra-thin copper foil with carrier, and method for manufacturing printed wiring board29 Apr 2021US 2021/0127503 A1Mitsui Mining & Smelting Co., Ltd.
Most cited
By later US patents
- Process for manufacturing panels to be used in microelectronic systems82US 4,404,059 A1983
- Multilayer wiring element having pin interface76US 7,911,805 B2Tessera, Inc. · 2011
- Interconnection element for electric circuits65US 8,299,368 B2Invensas Corporation · 2012
- Three-dimensional multi-layer circuit structure and method for forming the same53US 5,738,797 AFord Global Technologies, LLC · 1998
- Substrate for a flexible microelectronic assembly and a method of fabricating thereof47US 7,659,617 B2Tessera, Inc. · 2010