Multilayer wiring element having pin interface

An interconnection element, comprising:

• a multilayer substrate having a plurality of conductive pads, the multilayer substrate having multiple wiring layers separated by at least one dielectric layer, the wiring layers including a plurality of conductive features exposed at a first face of the multilayer substrate;
• and at least one of a dielectric layer or one or more second features exposed at a second face of the multilayer substrate remote from the first face;
• a plurality of substantially rigid conductive posts protruding in a direction away from the first face to a height above the first face, the posts made of metal having a melting point substantially higher than a melting point of a joining metal such that the posts are adapted to remain solid during a joining process;
• a joining layer positioned between the multilayer substrate and the plurality of posts, the joining layer having first and second surfaces and a plurality of metallized vias extending between the first and second surfaces, the plurality of metallized vias are positioned to electrically couple the plurality of posts to the plurality of conductive pads on the multilayer substrate.

A method of forming contacts for an interconnection element, comprising:

• (a) joining a conductive element to an interconnection element having multiple wiring layers with a dielectric layer disposed between the conductive element and the interconnection element;
• (b) patterning the conductive element to form conductive pins such that at least a portion of a major surface of the dielectric layer is exposed between at least some of the pins;
• (c) then forming openings in the dielectric layer extending from the exposed portions of the major surface;
• and
• (d) then electrically interconnecting the conductive pins with conductive features of the interconnection element through the openings in the dielectric layer.

A method of forming an interconnection element, comprising:

• providing a multilayer substrate having a plurality of contact pads, the multilayer substrate including multiple wiring layers separated by at least one dielectric layer, the wiring layers including a plurality of conductive features exposed at a first face of the multilayer substrate;
• and at least one of a dielectric layer or one or more second features exposed at a second face of the multilayer substrate remote from the first face;
• securing a metal layer to the multilayer substrate with a joining layer;
• forming a plurality of substantially rigid conductive posts from the metal layer, the posts having edges defining a maximum extent of the posts in a lateral direction along the joining layer;
• and
• forming a plurality of metallized vias within the joining layer, the metallized vias electrically coupling the contact pads of the multilayer substrate with the plurality of posts, the metallized vias being disposed beyond the edges of the posts.