Printed wiring board and method for manufacturing the same
AssigneeIbiden Co., Ltd.
InventorSatoru Kawai
Life of this patent
Estimating the term…
Abstract
A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and having a conductor pad, a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and has an opening exposing the conductor pad in the conductor layer, and a bump formed on the conductor pad of the conductor layer and including a base plating layer formed in the opening of the solder resist layer, an intermediate layer formed on the base plating layer, and a top plating layer formed on the intermediate layer such that that the base plating layer has a side surface exposed from the solder resist layer and that the intermediate layer has a side surface protruding from the side surface of the base plating layer.
Claims20
A printed wiring board, comprising:
- a base insulating layer;
- a conductor layer formed on the base insulating layer and having a conductor pad;
- a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and has an opening exposing the conductor pad in the conductor layer;
- and
- a bump formed on the conductor pad of the conductor layer and comprising a base plating layer formed in the opening of the solder resist layer, an intermediate layer formed on the base plating layer, and a top plating layer formed on the intermediate layer such that the base plating layer has a side surface exposed from the solder resist layer and that the intermediate layer has a side surface protruding from the side surface of the base plating layer.
A method for manufacturing a printed wiring board, comprising:
- forming, on a base insulating layer, a conductor layer including a conductor pad;
- forming a solder resist layer on the base insulating layer such that the solder resist layer covers the conductor layer and has an opening exposing the conductor pad in the conductor layer;
- forming a seed layer such that the seed layer is formed on the conductor pad in the conductor layer, a surface of the solder resist layer and a side surface of the solder resist layer in the opening;
- and
- forming a bump on the conductor pad of the conductor layer such that the forming of the bump includes forming a base plating layer in the opening of the solder resist layer, forming an intermediate layer on the base plating layer, forming a top plating layer on the intermediate layer, and etching the seed layer such that the seed layer is removed from the surface of the solder resist layer,
- wherein the etching of the seed layer includes etching a portion of the base plating layer such that a side surface of the base plating layer exposed from the solder resist layer is selectively etched and that a side surface of the intermediate layer protrudes from the side surface of the base plating layer.
Dependencies are inferred from the claim text.