Ultra-thin copper foil, ultra-thin copper foil with carrier, and method for manufacturing printed wiring board
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorYoshinori MATSUURA
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Abstract
An extremely thin copper foil is provided that enables formation of highly fine different wiring patterns with a line/space (L/S) of 10 μm or less/10 μm or less on two sides of the copper foil and is thus usable as an inexpensive and readily processable substitution for silicon and glass interposers. The extremely thin copper foil includes, in sequence, a first extremely thin copper layer, an etching stopper layer, and the second extremely thin copper layer. Two sides of the extremely thin copper foil each have an arithmetic average roughness Ra of 20 nm or less.
Claims14
An extremely thin copper foil comprising, in sequence:
- a first extremely thin copper layer;
- an etching stopper layer;
- and
- a second extremely thin copper layer,
- wherein two sides of the extremely thin copper foil each have an arithmetic average roughness Ra of 20 nm or less.
Dependencies are inferred from the claim text.