US 12,193,152 B2 · Circuit board

Abstract

A circuit board according to an embodiment includes an insulating layer; a first circuit pattern disposed on a first surface of the insulating layer; a first solder resist disposed on the first surface of the insulating layer; and a first barrier layer including a first-first portion disposed between the first solder resist and the first circuit pattern, and a first-second portion disposed between the insulating layer and the first circuit pattern; wherein the firs-first portion of the first barrier layer includes: a first-first gold (Au) layer disposed under a lower surface of the first circuit pattern; and a first-first palladium (Pd) layer disposed under a lower surface of the first-first gold (Au) layer; wherein the first-second portion of the first barrier layer includes: a first-second gold (Au) layer disposed to surround a side surface and an upper surface of the first circuit pattern; and a first-second palladium (Pd) layer disposed to surround the first-second gold (Au) layer; and wherein the first circuit pattern is not in contact with the first solder resist and the insulating layer by the first-first portion and the first-second portion of the first barrier layer.

Claims18

Dependent claims

A circuit board comprising:

a first protective layer;
a first circuit pattern disposed on the first protective layer;
an insulating layer disposed on the first protective layer and the first circuit pattern;
and
a first barrier layer surrounding an upper surface, a side surface and a lower surface of the first circuit pattern and disposed in the first protective layer and the insulating layer,
wherein the first barrier layer includes a first portion disposed in the first protective layer, and a second portion disposed in the insulating layer,
wherein the first portion of the first barrier layer includes:
a first metal layer disposed under the lower surface of the first circuit pattern;
and
a second metal layer disposed under a lower surface of the first metal layer and including a metal material different from that of the first metal layer,
wherein the second portion of the first barrier layer includes:
a third metal layer disposed surrounding the side surface and the upper surfaces of the first circuit pattern
and including the same metal material as that of the first metal layer;
and
a fourth metal layer disposed surrounding the third metal layer and including the same metal material as the second metal layer.

12 more elements

Dependencies are inferred from the claim text.

Circuit board

Life of this patent

Circuit board

Life of this patent

Abstract

Claims18