Etchant for etching triple layer metal wiring structures of molybdenum/copper/molybdenum or molybdenum alloy/copper/molybdenum, and application thereof
AssigneeTcl China Star Optoelectronics Technology Co., Ltd.
InventorJing Liu
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Abstract
An etchant composition for etching a triple layer metal wiring structure of molybdenum/copper/molybdenum or molybdenum alloy/copper/molybdenum alloy, and a use thereof are disclosed. The etchant composition includes hydrogen peroxide, glycol, an etching inhibitor, a chelating agent, an etching additive, a pH adjuster, and water, The etchant can not only slow down the decomposition of hydrogen peroxide, but also extend the lifespan of the etchant, thereby greatly reducing the costs of the etchant in the manufacturing process, and improving the safety factor of the etchant.
Claims20
An etchant composition for etching a triple layer metal wiring structure of molybdenum/copper/molybdenum or molybdenum alloy/copper/molybdenum alloy, wherein the etchant composition comprises:
- hydrogen peroxide, glycol, an etching inhibitor, a chelating agent, an etching additive, a pH adjuster, and water;
- wherein the glycol is at least one selected from ethylene glycol, propylene glycol, diethylene glycol, propane-1,2-diol, triethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptandiol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, cyclopentane-1,2-diol, and cyclohexane-1,4-diol.
Dependencies are inferred from the claim text.