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US 7,659,617 B2Granted
Substrate for a flexible microelectronic assembly and a method of fabricating thereof
AssigneeTessera, Inc.
InventorsTeck-Gyu Kang, Jae M. Park, Yoichi Kubota
Life of this patent
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Abstract
Substrates having integrated rigid and flexible regions and methods of fabricating such substrates are disclosed. The substrates may advantageously be used for mounting semiconductor chips used in flexible microelectronic assemblies.
Claims23
A substrate for use in a microelectronic assembly comprising:
- (a) a unitary dielectric structure having first and second regions, said dielectric structure bearing contact elements in said first region and bearing unitary traces extending between said first and second regions, at least some of said traces being connected to at least some of the contact elements;
- and
- (b) a first dielectric encapsulant disposed on said dielectric structure in said first region, said first dielectric encapsulant being disposed so that said contact elements are exposed at a surface of the first dielectric encapsulant in said first region.
A microelectronic assembly, comprising:
- a substrate including:
- (a) a dielectric structure having first and second regions, said dielectric structure bearing contact elements in said first region and bearing unitary traces extending between said first and second regions, at least some of said traces being connected to at least some of the contact elements;
- and
- (b) a first dielectric encapsulant disposed on said structure in said first region, said first dielectric encapsulant being disposed so said contact elements are exposed at a surface of the first dielectric encapsulant in said first region;
- and
- at least one microelectronic device which terminals are selectively connected to said contact elements using a ball bonding technique or a wire bonding technique.
3 more elements
Dependencies are inferred from the claim text.