Interconnection element for electric circuits
AssigneeInvensas Corporation
InventorKimitaka Endo
Life of this patent
Estimating the term…
Abstract
An interconnection element and method for making same is disclosed. The interconnection element may include a plurality of metal conductors, a plurality of solid metal bumps and a low melting point (LMP) metal layer. The solid metal bumps overly and project in a first direction away from respective ones of the conductors. Each bump has at least one edge bounding the bump in at least a second direction transverse to the first direction. The low melting point (LMP) metal layer has a first face joined to the respective ones of the conductors and bounded in the second direction by at least one edge and a second face joined to the bumps. The edges of the bumps and the LMP layer are aligned in the first direction, and the LMP metal layer has a melting temperature substantially lower than the conductors.
Claims31
An interconnection element comprising:
- a plurality of metal conductors;
- a plurality of solid metal bumps overlying and projecting in a first direction away from respective ones of the conductors, each bump having at least one edge bounding the bump in at least a second direction transverse to the first direction;
- and
- a low melting point (LMP) metal layer having a first face joined to the respective ones of the conductors and bounded in the second direction by at least one edge and a second face joined to the bumps,
- wherein the edges of the bumps and the LMP layer are aligned in the first direction, and
- wherein the LMP metal layer has a melting temperature substantially lower than the conductors.
A microelectronic assembly comprising:
- a first substrate having a first surface;
- a first thin conductive element exposed on the first surface and having a first face;
- a first conductive projection having a base defining a first area and connected to the first face, the projection extending to an end remote from the first face and defining a second area that is less than the first area, a side wall being defined between the base and the end and constantly tapering in a direction from the base to the end;
- a dielectric material layer having a second surface and a third surface remote from the second surface, the second surface extending along the first surface of the first substrate, the dielectric material layer having a first opening formed therein, the first opening having a periphery;
- and
- a first solder mass formed on the first conductive projection, extending along the end and a portion of the side wall to a location disposed between the base and the end;
- wherein the first conductive projection extends through the first opening such that the periphery thereof contacts a portion of the side wall, and the solder mass extends towards the third surface of the dielectric material layer.
A component, comprising:
- a substrate having a first surface;
- a conductive pad exposed at the first surface;
- a conductive post having a first portion formed of at least one of copper or copper alloy overlying a portion of the conductive pad, and having a second portion connecting the first portion with the conductive pad, the first portion of the conductive post having an end remote from the conductive pad and a sidewall extending from the end towards the conductive pad, wherein the second portion does not extend beyond the first portion in directions along the first surface;
- a dielectric material layer overlying the substrate and contacting the sidewall of the conductive post, the dielectric material layer having a second surface at a height above the first surface, wherein the dielectric material layer contacts the first and second portions of the conductive post;
- and
- a conductive mass joined to the end of the conductive post and contacting the sidewall above the second surface of the dielectric material layer.
A component, comprising:
- a substrate having a first surface;
- a conductive pad exposed at the first surface;
- a conductive post having a first portion having a first melting point overlying a portion of the conductive pad, and having a second portion having a second melting point lower than the first melting point connecting the first portion with the conductive pad, the first portion of the conductive post having an end remote from the conductive pad and a sidewall extending from the end towards the conductive pad, wherein the second portion does not extend beyond the first portion in directions along the first surface;
- a dielectric material layer overlying the substrate and contacting the sidewall of the conductive post, the dielectric material layer having a second surface at a height above the first surface, wherein the dielectric material layer contacts the first and second portions of the conductive post;
- and
- a conductive mass joined to the end of the conductive post and contacting the sidewall above the second surface of the dielectric material layer.
Dependencies are inferred from the claim text.