Base material for printed circuit board and printed circuit board
AssigneesSumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.
InventorsMotohiko Sugiura, Issei Okada, Takashi Kasuga, Yoshio Oka, Kenji Ohki
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Abstract
According to the present invention, a base material for a printed circuit board includes: an insulating base film; and a metal layer that is layered on at least one surface of the base film and that includes copper as a main component, wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film, Cr<0.1 mg/m2, and Ni<0.1 mg/m2, wherein an arithmetic mean roughness (Sa) of the surface of the base film on which the metal layer is layered is less than 0.10 μm.
Claims8
A base material for a printed circuit board comprising:
- an insulating base film;
- and
- a metal layer that is layered on at least one surface of the base film and that includes copper as a main component,
- wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film,
- Cr<0.1 mg/m2, and
- Ni<0.1 mg/m2,
- wherein an arithmetic mean roughness (Sa) of the surface of the base film on which the metal layer is layered is less than 0.10 μm.
Dependencies are inferred from the claim text.