H05K 2201/035
Paste overlayer, i.e. conductive paste or solder paste over conductive layer
H05K2201/035 (Paste overlayer, i.e. conductive paste or solder paste over conductive layer) appears on 266 US grants and 194 published applications in this corpus.
Search patents in H05K- Granted patents
- 266
- Published applications
- 194
- Assignees
- 148
- Inventors
- 622
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 0 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 7 | 0 |
| 1989 | 8 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 7 | 0 |
| 1997 | 4 | 0 |
| 1998 | 14 | 0 |
| 1999 | 6 | 0 |
| 2000 | 17 | 0 |
| 2001 | 14 | 4 |
| 2002 | 9 | 10 |
| 2003 | 7 | 7 |
| 2004 | 9 | 16 |
| 2005 | 11 | 18 |
| 2006 | 6 | 14 |
| 2007 | 10 | 12 |
| 2008 | 8 | 11 |
| 2009 | 3 | 16 |
| 2010 | 9 | 13 |
| 2011 | 8 | 9 |
| 2012 | 9 | 3 |
| 2013 | 6 | 3 |
| 2014 | 4 | 3 |
| 2015 | 7 | 12 |
| 2016 | 8 | 2 |
| 2017 | 6 | 5 |
| 2018 | 1 | 0 |
| 2019 | 1 | 7 |
| 2020 | 3 | 4 |
| 2021 | 5 | 7 |
| 2022 | 3 | 5 |
| 2023 | 6 | 5 |
| 2024 | 4 | 5 |
| 2025 | 3 | 2 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Flexible printed circuit board18 Aug 2026US 12,713,522 B2Lisa Dräxlmaier GmbH
- Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon5 May 2026US 12,620,510 B2TE Connectivity Germany GmbH
- Printed circuit board, battery module, battery pack, and electrical device5 May 2026US 12,620,635 B2Contemporary Amperex Technology (Hong Kong) Limited
- Applying a solderable surface to conductive ink28 Oct 2025US 12,457,693 B2International Business Machines Corporation
- Application of electrical conductors to an electrically insulating substrate14 Oct 2025US 12,446,160 B2Landa Labs (2012) Ltd.
- Microelectronic Packaging Using Circuits on Glass and Stacking Glass Circuits5 Feb 2026US 2026/0040463 A1Sciperio, Inc
- Flexible printed circuit board31 Jul 2025US 2025/0247951 A1Lisa Dräxlmaier GmbH
- Member for interconnecting electrically a printed circuit board and at least one piece of electrical equipment, and connecting method5 Jun 2025US 2025/0185164 A1Safran
- Circuit Board and Manufacturing Method Thereof, and Terminal Device11 Jul 2024US 2024/0237194 A9Honor Device Co., Ltd.
- Systems and methods for additive manufacturing of electronics16 May 2024US 2024/0164016 A1
Most cited
By later US patents
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Conductive elastomeric contacts and connectors186US 3,971,610 ATechnical Wire Products, Inc. · 1976
- Method of making components with solder balls162US 6,165,885 AInternational Business Machines Corporation · 2000
- Method of aligning and mounting solder balls to a substrate131US 5,118,027 AInternational Business Machines Corporation · 1992
- Direct chip attachment structure and method131US 5,439,162 AMotorola, Inc. · 1995