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US 5,439,162 AGranted
Direct chip attachment structure and method
AssigneeMotorola, Inc.
InventorsReed A. George, John P. Cheraso, Douglas W. Hendricks
Life of this patent
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AssigneeMotorola, Inc.
InventorsReed A. George, John P. Cheraso, Douglas W. Hendricks
Estimating the term…
An integrated circuit (70) is soldered to a printed circuit board (200) by first depositing flux (116) on bumps (75) of the integrated circuit. Solder (214) is deposited upon the bumps (75), and the integrated circuits is (70) placed in contact with pads (210) on the printed circuit board (200). After reflow, a solder joint (230) electrically and mechanically attaches the integrated circuit (70) to the printed circuit board (200). Alternatively, the solder tipped (214) bumps (75) may be placed in contact with a non-adhering flat plane (300) such as glass during the heating process. After reflow, each bump has a flat portion (350), and the flat portions of all the bumps form a plane (400) which further facilitates attaching the integrated circuit (70) to the printed circuit board (200).
A method of attaching an integrated circuit to another circuit, the integrated circuit having a multiplicity of bumps attached directly to the integrated circuit for soldering the integrated circuit to the other circuit, each bump being substantially spherical and having a diameter ranging from substantially two to six mils, said method comprising the steps of:
A method for use in attaching an integrated circuit having a multiplicity of bumps to another circuit, said method comprising the step of:
A method for use in attaching an integrated circuit having a multiplicity of bumps to another circuit, said method comprising the step of:
The method according to 10 wherein the substantially planar non-adhering surface means comprises glass.
Dependencies are inferred from the claim text.