Systems and methods for additive manufacturing of electronics

A method of manufacturing a printed wiring assembly “PWA” on a substrate, said method comprising:

• receiving assembly data associated with said PWA;
• dispensing, onto said substrate, and in accordance with the assembly data, a conductive ink “CI”;
• dispensing, onto the dispensed conductive ink, and in accordance with the assembly data, a thin film of silver;
• co-curing the dispensed conductive ink and dispensed silver, forming a silver over CI finish;
• depositing a solder material on top of at least a portion of the silver over CI finish;
• picking and placing, in accordance with the assembly data, one or more components on the deposited solder material;
• and
• performing reflow soldering, by heating, of the deposited solder material, the one or more placed components, and the silver over CI finish, forming an intermetallic compound therebetween.

A system for manufacturing a printed wiring assembly “PWA” on a substrate, said system comprising:

• at least one processor, configured to receive assembly data associated with said PWA;
• at least one positioning system;
• a plurality of dispensing units;
• at least one energy source;
• and
• at least one pick and place “P&P” unit,
• wherein at least one of the plurality of dispensing units is configured to dispense a conductive ink according to the assembly data,
• wherein the at least one energy source is configured to cure the dispensed conductive ink, and wherein the at least one energy source is configured to reduce, by plasma treatment, the cured conductive ink,
• wherein at least one of the plurality of dispensing units, or the at least one P&P unit, is configured to deposit a solder material on top of at least a portion of the reduced conductive ink,
• wherein the at least one P&P unit is configured to pick and place one or more components on the deposited solder material, according to the assembly data,
• wherein the at least one energy source is configured to perform reflow soldering of the deposited solder material, the one or more placed components, and the reduced conductive ink, forming an intermetallic compound therebetween, and
• wherein the at least one positioning system is configured to control a position and orientation of at least one of:
• the substrate;
• one or more dispensing units of the plurality of dispensing units;
• the at least one energy source;
• and/or the at least one P&P unit.