US 2026/0040463 A1 · Microelectronic Packaging Using Circuits on Glass and Stacking Glass Circuits

Abstract

A method for creating and stacking glass substrates containing conductive lines, vias, and passive components to form high-density, three-dimensional microelectronic packages. The invention employs a conductive nanoparticle paste for bonding, with silver nanopaste offering significant advantages in terms of process temperature and stability. The method includes precise control mechanisms for separation thickness, edge sealing, outgassing control, vacuum sealing, connector integration, and real-time data collection using IoT sensors. These innovations enable the creation of complex 3D structures with tight tolerance, high reliability, and suitability for electronics, photonics and including RF applications and other high-frequency applications.

Claims27

Dependent claims

A method for fabricating a microelectronic package using glass or ceramic substrates, the method comprising:

providing a plurality of substrates, wherein each of the plurality of substrates is one of a glass substrate and a ceramic substrate;
applying a first amount of a conductive nanoparticle paste on at least one of a top surface of a first of the plurality of substrates and a bottom surface of a second of the plurality of substrates;
stacking the first of the plurality of substrates and the second of the plurality of substrates such that the top surface of the first of the plurality of substrates is positioned to bond with the bottom surface of the second of the plurality of substrates to form a stack;
and
sintering the first amount of the conductive nanoparticle paste to provide both electrical and mechanical bonding between the first of the plurality of substrates and the second of the plurality of substrates.

2 more elements

Dependencies are inferred from the claim text.

Microelectronic Packaging Using Circuits on Glass and Stacking Glass Circuits

Life of this patent

Microelectronic Packaging Using Circuits on Glass and Stacking Glass Circuits

Life of this patent

Abstract

Claims27