Flexible printed circuit board

Abstract

A flexible printed circuit board includes a flexible substrate layer on which a plurality of electrically conductive connections are arranged as conductive tracks and a flexible coverlay connected to the flexible substrate layer. The flexible coverlay covers the conductive tracks. The flexible coverlay has, in at least one solder area, a coverlay opening which exposes a plurality of spaced-apart component connection pads to receive a solder paste and which delimits the at least one solder area on a periphery, so that the plurality of spaced-apart component connection pads when provided with solder paste form a plurality of solder pads which adjoin, at least in part, an opening edge area of the coverlay opening to provide a solder stop. The opening edge area of the coverlay opening is, at least partially, non-linear and has a curve shape.

Dependencies are inferred from the claim text.