H05K 2201/0344
Electroless sublayer
Official title: Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
H05K2201/0344 (Electroless sublayer) appears on 97 US grants and 95 published applications in this corpus.
Search patents in H05K- Granted patents
- 97
- Published applications
- 95
- Assignees
- 68
- Inventors
- 282
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 0 |
| 2002 | 2 | 4 |
| 2003 | 2 | 2 |
| 2004 | 1 | 1 |
| 2005 | 0 | 1 |
| 2006 | 1 | 2 |
| 2007 | 2 | 5 |
| 2008 | 0 | 3 |
| 2009 | 1 | 7 |
| 2010 | 3 | 4 |
| 2011 | 1 | 2 |
| 2012 | 1 | 3 |
| 2013 | 1 | 1 |
| 2014 | 0 | 3 |
| 2015 | 4 | 6 |
| 2016 | 5 | 2 |
| 2017 | 3 | 2 |
| 2018 | 1 | 2 |
| 2019 | 2 | 3 |
| 2020 | 6 | 6 |
| 2021 | 4 | 8 |
| 2022 | 3 | 4 |
| 2023 | 4 | 6 |
| 2024 | 4 | 8 |
| 2025 | 4 | 6 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate for printed circuit board and printed circuit board21 Jul 2026US 12,690,128 B2Sumitomo Electric Industries, Ltd.
- Transparent package for use with printed circuit boards14 Jul 2026US 12,684,689 B2Honeywell Federal Manufacturing & Technologies, LLC
- Flexible printed circuit board and method of manufacturing flexible printed circuit board26 May 2026US 12,641,723 B2Sumitomo Electric Industries, Ltd.
- Copper clad laminate and method for producing the same14 Apr 2026US 12,604,417 B2Toyo Kohan Co.Ltd
- RF cover layer23 Dec 2025US 12,507,347 B2Raytheon Company
- Packaging substrate and manufacture method for the same25 Jun 2026US 2026/0182419 A1Absolics Inc.
- Substrate for printed wiring board and printed wiring board14 May 2026US 2026/0136473 A1Sumitomo Electric Industries, Ltd.
- Wiring board and mounting structure using the wiring board16 Apr 2026US 2026/0107383 A1KYOCERA Corporation
- Ultra-thin copper foil with carrier foil and method for manufacturing embedded substrate by using same29 Jan 2026US 2026/0032815 A1Lotte Energy Materials Corporation
- Substrate for printed circuit board and printed circuit board27 Nov 2025US 2025/0365861 A1Sumitomo Electric Industries, Ltd.
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995
- Thermally stable dual metal coated laminate products made from textured polyimide film78US 4,868,071 APolyonics Corporation · 1989
- Metal-clad laminates68US 3,984,598 AUniversal Oil Products Company · 1976
- Method of fabricating metallized vias with steep walls47US 5,897,368 AGeneral Electric Company · 1999