RF cover layer

A method of making a printed circuit board, comprising:

• providing a support structure;
• applying a conductive layer to the support structure, the conductive layer comprising a first portion of conductive material and a second portion of conductive material separated by a gap that defines a spacing between the first portion of conductive material and the second portion of conductive material, wherein the gap does not contain conductive material;
• forming a mask structure on the conductive layer, the mask structure defining at least a first region on the conductive layer and a second region on the conductive layer, wherein the first region is enclosed by a boundary defined by the mask structure and wherein the second region lies outside of the boundary, wherein the first region includes the gap;
• coupling a cover layer sized to fit within the first region to the first region, wherein the cover layer comprises a laminatible insulating material configured to flow within the first region during a lamination process, wherein the boundary is configured to prevent the laminatible insulating material from flowing into the second region, and wherein the laminatible insulating material is configured to flow to fill at least a portion of the gap during the lamination process, wherein a combination of the support structure, conductive layer, mask structure, and cover layer define a printed circuit board assembly;
• and
• laminating the printed circuit board assembly.

A printed circuit board, comprising:

• a support structure;
• a conductive RF circuit layer operably coupled to the support structure, the conductive RF circuit layer comprising a first RF circuit formed using a first portion of conductive material and a second RF circuit formed using a second portion of conductive material, wherein the first RF circuit and the second RF circuit are separated by a gap that does not contain conductive material;
• a mask structure formed on at least one of the first RF circuit and the second RF circuit, the mask structure defining at least a first region overlaying at least a portion of the first RF circuit and at least a first portion of the second RF circuit and overlaying the gap and defining a second region that overlays a second portion of the second RF circuit, wherein the first region is enclosed by a boundary defined by the mask structure and wherein the second region lies outside of the boundary;
• and
• a cover layer sized to fit within the first region, wherein the cover layer comprises a laminatible insulating material configured to flow within the first region during a lamination process, wherein the boundary is configured to prevent the laminatible insulating material from flowing into the second region, and wherein the laminatible insulating material is configured to flow to fill at least a portion of the gap during the lamination process.