Flexible printed circuit board and method of manufacturing flexible printed circuit board
AssigneesSumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.
InventorsYosuke Fukaya, Koji Nitta, Daisuke Sato
Life of this patent
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Abstract
A flexible printed circuit board according to an embodiment includes a base film and a first wire. The base film has a first surface. The first wire is disposed on the first surface. The first wire has a first layer and a second layer. The first layer is disposed on the first surface directly or indirectly. The second layer covers the first layer. In the first surface, a first groove is formed next to the first layer in a plan view. The second layer on a side surface of the first layer exists on a bottom surface and a side surface of the first groove.
Claims8
A flexible printed circuit board comprising:
- a flexible base film comprising a flexible resin material having a first surface;
- and
- a first wire disposed on the first surface,
- wherein the first wire has a first layer disposed on the first surface directly or indirectly and a second layer covering the first layer,
- wherein in the first surface, a first groove is formed recessed into the first surface next to the first layer in a plan view,
- wherein the second layer includes a surface in contact with a side surface of the first layer and extends into the first groove, contacting a bottom surface and a side surface of the first groove, and
- wherein the bottom surface of the first groove, in side cross-sectional view, is lower than the entire bottom surface of the first layer.
A method of manufacturing a flexible printed circuit board, the method comprising:
- preparing a flexible base film comprising a flexible resin material having a first surface;
- and
- forming a wire on the first surface,
- wherein forming the wire includes forming a first layer on the first surface, forming a groove recessed into the first surface by using the first layer as a mask and etching the first surface next to the first layer in a plan view, and forming a second layer so as to cover the first layer,
- wherein the second layer includes a surface in contact with a side surface of the first layer and extends into the first groove, contacting a bottom surface and a side surface of the groove, and
- wherein the bottom surface of the first groove, in side cross-sectional view, is lower than the entire bottom surface of the first layer.
Dependencies are inferred from the claim text.