Ultra-thin copper foil with carrier foil and method for manufacturing embedded substrate by using same
AssigneeLotte Energy Materials Corporation
InventorsChang Yol YANG, Won Jin BEOM, Hyung Cheol KIM, Kideok SONG
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Abstract
Disclosed are an ultra-thin copper foil with a carrier foil and a method for manufacturing an embedded substrate by using the same, the ultra-thin copper foil with a carrier foil including: a carrier foil; a non-etching release layer on the carrier foil; a first ultra-thin copper foil layer on the non-etching release layer; an etch stop layer on the first ultra-thin copper foil layer; and a second ultra-thin copper foil layer on the etch stop layer.
Claims7
-14. (canceled)
A method utilizing an ultra-thin copper foil with a carrier foil, wherein the ultra-thin copper foil comprises:
- a carrier foil;
- a non-etching release layer on the carrier foil;
- a first ultra-thin copper foil layer on the non-etching release layer;
- an etch stop layer on the first ultra-thin copper foil layer;
- and
- a second ultra-thin copper foil layer on the etch stop layer,
- wherein the first ultra-thin copper foil layer, the etch stop layer, and the second ultra-thin copper foil layer are formed by plating,
- wherein the etch stop layer is inert to an etchant for the second ultra-thin copper foil layer, and has an average roughness Rz of 0.5 μm or less,
- wherein the second ultra-thin copper foil layer has an average roughness Rz of 0.6 μm or less, attributed to the low roughness of the etch stop layer,
- the method comprising:
- forming a metal pattern for manufacturing an embedded substrate on the second ultra-thin copper foil layer, wherein the forming uses the second ultra-thin copper foil layer, which is configured to reduce the occurrence of surface bumps due to the low roughness formed of 0.6 μm or less of the second ultra-thin copper foil layer, and
- patterning the second ultra-thin copper foil layer, wherein the etch stop layer is adapted so that the bumps on an exposed portion of the second ultra-thin copper foil layer are removed by using the etch stop layer in the patterning of the second ultra-thin copper foil layer.
Dependencies are inferred from the claim text.