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US 2026/0136473 A1Published application
Substrate for printed wiring board and printed wiring board
AssigneeSumitomo Electric Industries, Ltd.
InventorsTakuto HIDANI, Kousuke MIURA, Katsunari MIKAGE, Koji NITTA, Yoshio OKA
Life of this patent
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Abstract
A substrate for a printed wiring-board comprises: a base film having a main surface; a sintered material layer disposed on the main surface of the base film and formed of a plurality of sintered copper particles; and an electroless copper plating layer disposed on the sintered material layer. A palladium content in the sintered material layer is 0.1 atomic percent or less.
Claims8
A substrate for a printed wiring board, the substrate comprising:
- a base film having a main surface;
- a sintered material layer disposed on the main surface and formed of a plurality of sintered copper particles;
- and
- an electroless copper plating layer disposed on the sintered material layer,
- wherein a palladium content in the sintered material layer is 0.1 atomic percent or less.
2 more elements
A printed wiring board comprising:
- a base film having a main surface;
- and
- a wiring line disposed on the main surface,
- wherein the wiring line has a sintered material layer disposed on the main surface and formed of a plurality of sintered copper particles, an electroless copper plating layer disposed on the sintered material layer, and an electrolytic copper plating layer disposed on the electroless copper plating layer, and
- a palladium content in the sintered material layer is 0.1 atomic percent or less.
2 more elements
Dependencies are inferred from the claim text.