Component carrier with stacked electrically conductive layers, embedded and on the surface

A package, comprising:

• a component carrier having a stack with a plurality of electrically conductive layer structures and at least one electrically insulating layer structure;
• at least one embedded electrically conductive layer structure, embedded in the at least one electrically insulating layer structure, and exposed at one main surface of the at least one electrically insulating layer structure,
• wherein the at least one embedded electrically conductive layer structure comprises a first amount of stacked electrically conductive layer structures;
• and
• at least one surface electrically conductive layer structure, provided on the main surface of the at least one electrically insulating layer structure,
• wherein the at least one surface electrically conductive layer structure comprises a second amount of stacked electrically conductive layer structures;
• and
• a component, embedded in and/or surface-mounted to the stack.

A method of manufacturing a component carrier, the method comprising:

• providing a stack, comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure;
• providing at least one embedded electrically conductive layer structure in the electrically insulating layer structure, such that the at least one embedded electrically conductive layer structure is exposed at one main surface of the at least one electrically insulating layer structure, wherein the at least one embedded electrically conductive layer structure comprises a first amount of stacked electrically conductive layer structures;
• and
• providing at least one surface electrically conductive layer structure on the main surface of the at least one electrically insulating layer structure, wherein the at least one surface electrically conductive layer structure comprises a second amount of stacked electrically conductive layer structures.