H05K 2201/0338
Layered conductor
Official title: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
H05K2201/0338 (Layered conductor) appears on 607 US grants and 864 published applications in this corpus.
Search patents in H05K- Granted patents
- 607
- Published applications
- 864
- Assignees
- 345
- Inventors
- 1,687
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 5 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 1 |
| 2002 | 7 | 1 |
| 2003 | 2 | 6 |
| 2004 | 3 | 6 |
| 2005 | 1 | 9 |
| 2006 | 3 | 8 |
| 2007 | 8 | 17 |
| 2008 | 2 | 10 |
| 2009 | 10 | 24 |
| 2010 | 6 | 12 |
| 2011 | 14 | 19 |
| 2012 | 11 | 20 |
| 2013 | 20 | 28 |
| 2014 | 14 | 38 |
| 2015 | 25 | 52 |
| 2016 | 27 | 36 |
| 2017 | 41 | 37 |
| 2018 | 30 | 41 |
| 2019 | 36 | 34 |
| 2020 | 41 | 51 |
| 2021 | 41 | 55 |
| 2022 | 48 | 68 |
| 2023 | 48 | 71 |
| 2024 | 50 | 50 |
| 2025 | 36 | 44 |
| 2026 | 22 | 126 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Enhanced subtractive etch anisotropy using etch rate gradient8 Sep 2026US 12,733,107 B2Intel Corporation
- Magnetic ceramic substrate, substrate manufacturing method, and circulator11 Aug 2026US 12,707,561 B2Mitsubishi Electric Corporation
- Wiring substrate4 Aug 2026US 12,701,658 B2Ibiden Co., Ltd.
- Wiring board and manufacturing method therefor28 Jul 2026US 12,696,385 B2Toppan Holdings Inc.
- Printed circuit board8 Oct 2026US 2026/0313787 A1Samsung Electro-Mechanics Co., Ltd.
- Component carrier with stacked electrically conductive layers, embedded and on the surface17 Sep 2026US 2026/0282223 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit board and display device provided with same17 Sep 2026US 2026/0282679 A1Sharp Display Technology Corporation
- Printed circuit board and manufacturing method thereof27 Aug 2026US 2026/0255479 A1Samsung Electro-Mechanics Co., Ltd.
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
Most cited
By later US patents
- Etching of metallic composite articles159US 6,468,439 B1BMC Industries, Inc. · 2002
- Laminated electronic module assembly131US 5,179,501 AMotorola, Inc. · 1993
- Circuit manufacturing using etched tri-metal media125US 6,365,057 B1BMC Industries, Inc. · 2002
- Lamination of circuit sub-elements while assuring registration120US 6,409,930 B1BMC Industries, Inc. · 2002
- Thin multi-layered structures providing rigidity and conductivity79US 8,879,266 B2Apple Inc. · 2014