Thin multi-layered structures providing rigidity and conductivity
AssigneeApple Inc.
InventorsDaniel W. Jarvis, Richard Hung Minh Dinh
Life of this patent
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Abstract
Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
Claims32
A portable electronic device, comprising:
- an outer housing;
- an internal support structure provided within the outer housing, the internal support structure being a multi-layered structure having at least (i) a first layer formed of a first material that primarily provides rigidity to the multi-layered structure, and (ii) a second layer formed of a second material that provides for enhanced conductivity as compared to conductivity of the first material, the second material being different than the first material;
- and
- at least one electrical component provided within the outer housing, the at least one electrical component being thermally and/or electrically coupled to the second layer of the internal support structure,
- wherein the first material comprises metal, and the second material comprises metal,
- wherein the second layer has greater conductivity than the first layer, and wherein the first layer has greater rigidity than the second layer, and
- wherein the first layer of the multi-layer structure has at least one opening proximate to the at least one electrical component provided within the housing, the at least one opening exposing the second layer of the multi-layer structure.
A method for assembly of a portable electronic device, the method comprising:
- providing a multi-layer metal structure to provide support for internal components of the portable electronic device, the multi-layer metal structure including at least one structural layer and at least one highly conductive layer;
- providing heat-generating electrical components of the portable electronic device that cooperate to support functions of the portable electronic device;
- and
- coupling at least one of the heat generating electrical components to the at least one highly conductive layer of the multi-layered structure.
A method for assembly of a portable electronic device, the method comprising:
- providing a multi-layered metal structure to provide support for internal components of the portable electronic device, the multi-layer metal structure including at least a first metal layer and at least a second metal layer, the first metal layer having at least one opening that exposes the second metal layer;
- providing heat-generating electrical components that cooperate to support functions of the portable electronic device;
- securing at least one of the heat-generating electrical components internal to the portable electronic device and adjacent the at least one opening in the first metal layer of the multi-layer metal structure;
- and
- thermally and/or electrically coupling the at least one of the secured heat generating electrical components to the second metal layer of the multi-layered structure via the at least one opening in the first metal layer.
Dependencies are inferred from the claim text.