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US 5,179,501 AGranted
Laminated electronic module assembly
AssigneeMotorola, Inc.
InventorsAlfred G. Ocken, Nathan A. Unterman, Timothy S. Fisher, Michael I. Petrites
Life of this patent
Estimating the term…
Abstract
An electronic module assembly includes a relatively thin, bendable base plate having at least one bend axis along which the base plate is bent over on itself to provide an enclosure. An inner surface of the base plate supports at least one, and preferably two, relatively thicker metal plates, one on each side of the bend axis, each metal plate acting as a heatsink for circuit components mounted thereon.
Claims12
A laminated electronic module assembly, comprising:
- a relatively thin base plate having at least one bend axis along which the base plate is bent over on itself to provide a cavity that is enclosed above and below by first and second, substantially parallel, interior surfaces of the bent base plate, at least one of said interior surfaces defining a first circuit component area located within the cavity and on one side of the bend axis;
- at least one un-bent metal plate that is thicker than the thin base plate, the metal plate being mounted within the cavity at the first circuit component area, the metal plate acting as a heatsink for one or more circuit components to be mounted thereon;
- and
- circuit components mounted on the relatively thicker metal plate.
1 more element
A laminated electronic module assembly comprising:
- a relatively thin base plate having at least one bend axis along which the base plate is bent over on itself to provide an inner surface and an outer surface, the inner surface having at least a first circuit component area located on one side of the bend axis;
- at least one relatively thick metal plate mounted on the inner surface of the base plate at the first circuit component area, the metal plate acting as a heatsink for one or more circuit components to be mounted thereon;
- and
- circuit components mounted on the relatively thick metal plate,
- wherein the thick metal plate is selected to have a surface area that is smaller than the base plate's surface area such that, upon mounting the relatively thick metal plate at the first circuit component area, a peripheral portion of the base plate is left uncovered by the relatively thick metal plate so that said peripheral portion may be more readily formed to assist in enclosing the circuit components,
- wherein the thin base plate has first and second ends which are adjacent to each other after the base plate has been bent, and wherein the ends are sealed together.
3 more elements
A laminated electronic module assembly comprising:
- a relatively thin base plate having at least one bend axis along which the base plate is bent over on itself to provide an inner surface and an outer surface, the inner surface having at least a first circuit component area located on one side of the bend axis;
- at least one relatively thick metal plate mounted on the inner surface of the base plate at the first circuit component area, the metal plate acting as a heatsink for one or more circuit components to be mounted thereon, the relatively thick metal plate being selected to have a surface area that is smaller than the base plate's surface area such that, upon mounting the relatively thick metal plate at the first circuit component area, a peripheral portion of the base plate is left uncovered by the relatively thick metal plate so that said peripheral portion may be more readily formed to assist in enclosing the circuit components;
- and
- a pair of side apertures formed by the bent base plate and bounded by peripheral portions of the base plate, and further including a pair of end caps for covering the apertures, the end caps having peripheral portions that are joined to the peripheral portions of the base plate.
1 more element
A laminated electronic module assembly, comprising:
- a relatively thin base plate having at least one bend axis along which the base plate is bent over on itself to provide an inner surface and an outer surface, the inner surface having first and second circuit component area, one such area being located on each side of the bend axis;
- a first un-bent metal plate that is thicker than the thin base plate, the un-bent metal plate having a bottom surface that is mounted on the inner surface of the base plate at the first circuit component area, and having a top surface;
- a second un-bent metal plate that is thicker than the thin base plate, the second un-bent metal plate having a bottom surface that is mounted on the inner surface of the thin base plate at the second circuit component area, and having a top surface;
- a flexible, continuous insulating film having a first portion that is bonded to the top surface of the first un-bent metal plate, a second portion that is bonded to the top surface of the second un-bent metal plate, and a middle, unbonded portion that overlies the bend axis and that electronically couples the first portion to the second portion;
- and
- circuit components mounted on the first and second portions of the insulating film.
3 more elements
Dependencies are inferred from the claim text.