H05K 2201/0388
Other aspects of conductors
H05K2201/0388 (Other aspects of conductors) appears on 1,443 US grants and 1,202 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,443
- Published applications
- 1,202
- Assignees
- 551
- Inventors
- 2,678
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 6 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 5 | 0 |
| 1981 | 2 | 0 |
| 1982 | 6 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 9 | 0 |
| 1986 | 8 | 0 |
| 1987 | 7 | 0 |
| 1988 | 9 | 0 |
| 1989 | 7 | 0 |
| 1990 | 23 | 0 |
| 1991 | 17 | 0 |
| 1992 | 19 | 0 |
| 1993 | 11 | 0 |
| 1994 | 26 | 0 |
| 1995 | 26 | 0 |
| 1996 | 20 | 0 |
| 1997 | 30 | 0 |
| 1998 | 43 | 0 |
| 1999 | 49 | 0 |
| 2000 | 42 | 0 |
| 2001 | 57 | 36 |
| 2002 | 70 | 83 |
| 2003 | 72 | 73 |
| 2004 | 67 | 81 |
| 2005 | 50 | 90 |
| 2006 | 79 | 116 |
| 2007 | 63 | 86 |
| 2008 | 47 | 67 |
| 2009 | 51 | 95 |
| 2010 | 55 | 50 |
| 2011 | 50 | 57 |
| 2012 | 46 | 38 |
| 2013 | 49 | 22 |
| 2014 | 34 | 34 |
| 2015 | 35 | 38 |
| 2016 | 28 | 36 |
| 2017 | 35 | 25 |
| 2018 | 25 | 25 |
| 2019 | 21 | 30 |
| 2020 | 26 | 30 |
| 2021 | 28 | 24 |
| 2022 | 16 | 19 |
| 2023 | 19 | 15 |
| 2024 | 19 | 15 |
| 2025 | 11 | 9 |
| 2026 | 5 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Fully printed sensor with internal ion reservoirs18 Aug 2026US 12,713,530 B2The Regents of the University of Colorado
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Sensor interposer employing castellated through-vias30 Jun 2026US 12,672,235 B2DexCom, Inc.
- Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon5 May 2026US 12,620,510 B2TE Connectivity Germany GmbH
- Circuit board, an image sensor module, a lens driving device, and a camera module including the same10 Feb 2026US 12,549,838 B2LG Innotek Co., Ltd.
- Sensor interposer employing castellated through-vias17 Sep 2026US 2026/0282225 A1DexCom, Inc.
- Temperature sensors and applications in wireless charging13 Aug 2026US 2026/0235451 A1Tesla, Inc.
- Printed circuit board with healable features25 Jun 2026US 2026/0181767 A1SanDisk Technologies LLC
- Circuit structure18 Jun 2026US 2026/0173262 A1Advanced Semiconductor Engineering, Inc.
- Methods for laser induced printing of electrodes with increased lifespan4 Jun 2026US 2026/0152859 A1Reophotonics, Ltd.
Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999