H05K 2201/0394
Conductor crossing over a hole in the substrate or a gap between
Official title: Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
H05K2201/0394 (Conductor crossing over a hole in the substrate or a gap between) appears on 833 US grants and 640 published applications in this corpus.
Search patents in H05K- Granted patents
- 833
- Published applications
- 640
- Assignees
- 340
- Inventors
- 1,511
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 7 | 0 |
| 1989 | 5 | 0 |
| 1990 | 12 | 0 |
| 1991 | 13 | 0 |
| 1992 | 10 | 0 |
| 1993 | 8 | 0 |
| 1994 | 22 | 0 |
| 1995 | 16 | 0 |
| 1996 | 17 | 0 |
| 1997 | 20 | 0 |
| 1998 | 28 | 0 |
| 1999 | 31 | 0 |
| 2000 | 30 | 0 |
| 2001 | 38 | 17 |
| 2002 | 44 | 52 |
| 2003 | 53 | 48 |
| 2004 | 43 | 54 |
| 2005 | 31 | 50 |
| 2006 | 47 | 72 |
| 2007 | 39 | 52 |
| 2008 | 30 | 41 |
| 2009 | 30 | 61 |
| 2010 | 35 | 34 |
| 2011 | 32 | 34 |
| 2012 | 30 | 19 |
| 2013 | 29 | 10 |
| 2014 | 18 | 13 |
| 2015 | 12 | 13 |
| 2016 | 13 | 7 |
| 2017 | 10 | 6 |
| 2018 | 4 | 7 |
| 2019 | 9 | 3 |
| 2020 | 6 | 10 |
| 2021 | 8 | 9 |
| 2022 | 5 | 6 |
| 2023 | 6 | 8 |
| 2024 | 8 | 7 |
| 2025 | 5 | 4 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Sensor interposer employing castellated through-vias30 Jun 2026US 12,672,235 B2DexCom, Inc.
- Circuit board, an image sensor module, a lens driving device, and a camera module including the same10 Feb 2026US 12,549,838 B2LG Innotek Co., Ltd.
- Method for producing a waveguide, circuit device and radar system14 Oct 2025US 12,444,821 B2Infineon Technologies AG
- Image forming apparatus30 Sep 2025US 12,429,794 B2Canon Kabushiki Kaisha
- Sensor interposer employing castellated through-vias17 Sep 2026US 2026/0282225 A1DexCom, Inc.
- Circuit board, an image sensor module, a lens driving device, and a camera module including the same21 May 2026US 2026/0143217 A1LG Innotek Co., Ltd.
- Bus bar assembly and battery module including the bus bar assembly23 Apr 2026US 2026/0112785 A1Samsung SDI.Co., Ltd.
- Image forming apparatus25 Dec 2025US 2025/0390033 A1Canon Kabushiki Kaisha
- Circuit board, lens driving device, and camera module including the same4 Sep 2025US 2025/0280494 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997
- Tamper-resistant wireless article including an antenna310US 6,421,013 B1Amerasia International Technology, Inc. · 2002
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992