H05K 2201/0391
Using different types of conductors
H05K2201/0391 (Using different types of conductors) appears on 194 US grants and 226 published applications in this corpus.
Search patents in H05K- Granted patents
- 194
- Published applications
- 226
- Assignees
- 151
- Inventors
- 537
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 5 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 2 |
| 2002 | 4 | 9 |
| 2003 | 3 | 8 |
| 2004 | 5 | 4 |
| 2005 | 1 | 7 |
| 2006 | 2 | 15 |
| 2007 | 9 | 14 |
| 2008 | 7 | 11 |
| 2009 | 4 | 9 |
| 2010 | 6 | 4 |
| 2011 | 6 | 7 |
| 2012 | 5 | 9 |
| 2013 | 6 | 4 |
| 2014 | 9 | 9 |
| 2015 | 9 | 17 |
| 2016 | 9 | 12 |
| 2017 | 14 | 10 |
| 2018 | 11 | 12 |
| 2019 | 5 | 21 |
| 2020 | 11 | 14 |
| 2021 | 13 | 7 |
| 2022 | 8 | 8 |
| 2023 | 9 | 4 |
| 2024 | 7 | 4 |
| 2025 | 1 | 1 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Fully printed sensor with internal ion reservoirs18 Aug 2026US 12,713,530 B2The Regents of the University of Colorado
- Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon5 May 2026US 12,620,510 B2TE Connectivity Germany GmbH
- Application of electrical conductors to an electrically insulating substrate14 Oct 2025US 12,446,160 B2Landa Labs (2012) Ltd.
- Printed circuit board24 Sep 2024US 12,101,880 B2Samsung Electro-Mechanics Co., Ltd.
- Electronic circuit production method using 3D layer shaping23 Jul 2024US 12,048,102 B2Fuji Corporation
- Temperature sensors and applications in wireless charging13 Aug 2026US 2026/0235451 A1Tesla, Inc.
- Printed circuit board with healable features25 Jun 2026US 2026/0181767 A1SanDisk Technologies LLC
- Methods for laser induced printing of electrodes with increased lifespan4 Jun 2026US 2026/0152859 A1Reophotonics, Ltd.
- Bus bar assembly and battery module including the bus bar assembly23 Apr 2026US 2026/0112785 A1Samsung SDI.Co., Ltd.
- Stretchable device13 Mar 2025US 2025/0089159 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Flexible backplane and methods for its manufacture55US 8,362,488 B2SiPix Imaging, Inc. · 2013
- Hybrid printed circuit board43US 5,434,749 AYazaki Corporation · 1995
- Interconnection apparatus for wiring harnesses35US 4,603,930 ASumitomo Electric Industries, Ltd. · 1986
- Hybrid integrated circuit and preparation thereof34US 4,521,476 ADenki Kagaku Kogyo Kabushiki Kaisha · 1985
- Circuit assembly and a method for making the same32US 6,490,786 B2Visteon Global Technologies, Inc. · 2002