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US 4,521,476 AGranted
Hybrid integrated circuit and preparation thereof
AssigneeDenki Kagaku Kogyo Kabushiki Kaisha
InventorsShinichiro Asai, Kazuo Katoh, Tatsuo Nakano
Life of this patent
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Abstract
A hybrid integrated circuit is prepared by laminating an aluminum-copper clad foil on an insulating layer, etching the aluminum-copper clad foil with etching agents to form an aluminum circuit and a copper circuit and connecting a semiconductor element to the aluminum circuit through an aluminum wire or a gold wire while connecting a circuit element to the copper circuit by soldering.
Claims7
A hybrid integrated circuit, comprising:
- an aluminum-copper clad foil on an insulating layer, wherein the upper metal foil of said aluminum-copper clad foil is etched into a predetermined circuit pattern by an etching agent which selectivity dissolves only the metal of said upper metal foil and then the lower metal foil is etched into a predetermined circuit pattern by an etching agent which selectivity dissolves only the metal of said lower metal foil, thereby forming a device having an aluminum circuit pattern and a copper circuit pattern, a semiconductor element connected to said aluminum circuit through an aluminum wire or a gold wire and a circuit element soldered to said copper circuit.
Dependencies are inferred from the claim text.