Interconnection apparatus for wiring harnesses

In an interconnection apparatus for wiring harnesses including a wiring board including a single-layer insulating board and a cover fitted over the wiring board to cover the same, the improvement wherein said wiring board comprises branch conductive path means formed by a busbar mounted on said insulating board and having a predetermined pattern including a plurality of tab contact members adapted to be connected to branch circuit means of the wiring harness, functional component circuit means formed by a plurality of functional components mounted on said insulating board and positioned on said wiring board to be fitted within the periphery of said cover, and printed wiring circuit means formed on said insulating board and interconnecting said branch conductive path means and said functional componenent circuit means, each of said tab contact members being formed into an L-shape and having a first leg extending parallel to said insulating board and in circuit with said printed wiring circuit means and a second terminal leg extending perpendicularly to said wiring board, said cover including a plurality of press pieces disposed to engage said first legs of said L-shaped tab contact members and restrain them relative to the insulating board to restrain them upon removal of an attached connector.