H05K 2201/032
Materials
H05K2201/032 (Materials) appears on 1,198 US grants and 1,429 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,198
- Published applications
- 1,429
- Assignees
- 736
- Inventors
- 3,362
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 15 | 0 |
| 1987 | 12 | 0 |
| 1988 | 6 | 0 |
| 1989 | 11 | 0 |
| 1990 | 13 | 0 |
| 1991 | 6 | 0 |
| 1992 | 16 | 0 |
| 1993 | 10 | 0 |
| 1994 | 10 | 0 |
| 1995 | 15 | 0 |
| 1996 | 12 | 0 |
| 1997 | 14 | 0 |
| 1998 | 11 | 0 |
| 1999 | 23 | 0 |
| 2000 | 8 | 0 |
| 2001 | 16 | 4 |
| 2002 | 16 | 26 |
| 2003 | 17 | 26 |
| 2004 | 20 | 33 |
| 2005 | 18 | 35 |
| 2006 | 19 | 47 |
| 2007 | 26 | 37 |
| 2008 | 24 | 54 |
| 2009 | 26 | 86 |
| 2010 | 26 | 63 |
| 2011 | 27 | 51 |
| 2012 | 51 | 56 |
| 2013 | 31 | 57 |
| 2014 | 38 | 64 |
| 2015 | 49 | 141 |
| 2016 | 69 | 94 |
| 2017 | 89 | 86 |
| 2018 | 83 | 68 |
| 2019 | 83 | 75 |
| 2020 | 48 | 59 |
| 2021 | 52 | 52 |
| 2022 | 39 | 49 |
| 2023 | 43 | 38 |
| 2024 | 38 | 51 |
| 2025 | 29 | 46 |
| 2026 | 18 | 31 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic component and method of manufacturing the same29 Sep 2026US 12,750,954 B2Murata Manufacturing Co., Ltd.
- Package structure29 Sep 2026US 12,750,978 B2TMY Technology Inc.
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Silver nanowire thin-film patterning method25 Aug 2026US 12,721,113 B2Seoul National University R&Db Foundation
- Insulating circuit board and semiconductor device using same25 Aug 2026US 12,721,197 B2Niterra Materials Co., Ltd.
- Printed wiring board and method for manufacturing the same3 Sep 2026US 2026/0262163 A1Ibiden Co., Ltd.
- Electrochemical biosensors and method of preparing electrochemical biosensors27 Aug 2026US 2026/0251608 A1Glc Medical (Glcm) Inc.
- Printed circuit board and manufacturing method thereof27 Aug 2026US 2026/0255479 A1Samsung Electro-Mechanics Co., Ltd.
- Carbon-based direct plating process13 Aug 2026US 2026/0234828 A1
- Electrically Conductive Adhesive Film6 Aug 2026US 2026/0226321 A13M Innovative Properties Company
Most cited
By later US patents
- Micro assembled LED displays and lighting elements254US 9,520,537 B2X-Celeprint Limited · 2016
- Process for producing electrical connections through a substrate191US 4,964,212 ACommissariat A L' Energie Atomique · 1990
- Methods of making garments having stretchable and conductive ink191US 8,945,328 B2L.I.F.E. Corporation S.A. · 2015
- Printed wiring board having highly reliably via hole and process for forming via hole129US 6,280,641 B1Mitsubishi Gas Chemical Company, Inc. · 2001
- Additive adhesive based process for the manufacture of printed circuit boards127US 4,581,301 A1986