Package structure

A package structure, comprising:

• a substrate, having a bearing surface and substrate pads on the bearing surface;
• an electronic component, disposed on the bearing surface through a portion of the substrate pads, wherein the electronic component has a first height;
• at least one heat conductor, disposed on the bearing surface, wherein the at least one heat conductor has a second height;
• an encapsulant, disposed on the bearing surface, and having a side covering the electronic component and the at least one heat conductor, wherein the encapsulant has a third height, and the third height is greater than or equal to the first height and the third height is greater than or equal to the second height;
• and
• a heat dissipation structure, disposed on the encapsulant,
• wherein a surrounding area where the substrate is in contact with the electronic component defines a heat-generating area, and the at least one heat conductor is disposed in the heat-generating area,
• wherein the at least one heat conductor comprises a ceramic material, and the at least one heat conductor is fixed on another portion of the substrate pads through connectors,
• wherein an orthographic projection of the another portion of the substrate pads on the substrate is overlapped with an orthographic projection of the heat conductor on the substrate but not overlapped with an orthographic projection of the electronic component on the substrate,
• wherein the substrate comprises an air gap, and an orthographic projection of the air gap on the substrate overlaps the orthographic projection of the electronic component on the substrate but does not overlap the orthographic projection of the at least one heat conductor on the substrate.