H05K 2201/0326
Inorganic, non-metallic conductor
Official title: Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
H05K2201/0326 (Inorganic, non-metallic conductor) appears on 248 US grants and 300 published applications in this corpus.
Search patents in H05K- Granted patents
- 248
- Published applications
- 300
- Assignees
- 208
- Inventors
- 783
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 2 |
| 2002 | 6 | 12 |
| 2003 | 3 | 7 |
| 2004 | 3 | 0 |
| 2005 | 5 | 9 |
| 2006 | 3 | 5 |
| 2007 | 3 | 8 |
| 2008 | 5 | 12 |
| 2009 | 8 | 20 |
| 2010 | 2 | 9 |
| 2011 | 6 | 7 |
| 2012 | 6 | 12 |
| 2013 | 5 | 14 |
| 2014 | 10 | 22 |
| 2015 | 16 | 50 |
| 2016 | 17 | 35 |
| 2017 | 27 | 17 |
| 2018 | 28 | 13 |
| 2019 | 15 | 16 |
| 2020 | 14 | 6 |
| 2021 | 8 | 5 |
| 2022 | 5 | 4 |
| 2023 | 6 | 3 |
| 2024 | 1 | 5 |
| 2025 | 2 | 6 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and method of fabricating the same21 Apr 2026US 12,610,473 B2China Avary Holding (Shenzhen) Co., Ltd.
- Silicon carbide thermal bridge integrated on a low thermal conductivity substrate and processes implementing the same26 Aug 2025US 12,402,240 B2Wolfspeed, Inc.
- Continuous interconnects between heterogeneous materials21 Jan 2025US 12,205,878 B2Liquid Wire Inc.
- Continuous interconnects between heterogeneous materials23 Jan 2024US 11,882,653 B2Liquid Wire Inc.
- Circuit board28 Nov 2023US 11,832,385 B2Dongwoo Fine-Chem Co., Ltd.
- Printed circuit board and manufacturing method thereof27 Aug 2026US 2026/0255479 A1Samsung Electro-Mechanics Co., Ltd.
- Transparent-freeform wiring with auxetic structure and method for manufacturing the same30 Oct 2025US 2025/0338397 A1Gwangju Institute of Science and Technology
- Circuit board and method of fabricating the same23 Oct 2025US 2025/0331106 A1Avary Holding (Shenzhen) Co., Limited.
- Method of making transparent composite articles30 Jan 2025US 2025/0033327 A1Eastman Kodak Company
- Transparent composite article with electrically-conductive pattern30 Jan 2025US 2025/0034345 A1Eastman Kodak Company
Most cited
By later US patents
- Process for producing electrical connections through a substrate191US 4,964,212 ACommissariat A L' Energie Atomique · 1990
- L.E.D Lighting unit with transparent carrier panel85US 6,270,236 B1Siemens Aktiengesellschaft · 2001
- Electrically conductive adhesive composition72US 4,696,764 AOsaka Soda Co., Ltd. · 1987
- LED lighting apparatus with transparent flexible circuit structure67US 7,604,377 B2Polytron Technologies, Inc. · 2009
- Method for fabricating thin touch sensor panels59US 7,918,019 B2Apple Inc. · 2011