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US 11,832,385 B2Granted
Circuit board
AssigneeDongwoo Fine-Chem Co., Ltd.
InventorsKi Joon Park, Sung Jin Noh, Jungu Lee
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Abstract
A circuit board includes a base layer, a seed layer formed on the base layer, and a first electrode layer formed on the seed layer. The seed layer is formed of a metal oxide with a thickness of 100 to 400 Å. The circuit board may further include an insulation layer formed on the first electrode layer and a second electrode layer formed on the insulation layer.
Claims3
A circuit board, comprising:
- a base layer, wherein the base layer is made of glass;
- a seed layer formed on the base layer, wherein the seed layer is formed to have a thickness of 100 to 400 Å;
- a first electrode layer formed on the seed layer;
- an insulation layer formed on the first electrode layer;
- a second electrode layer formed on the insulation layer;
- a via penetrating the insulation layer to connect the first electrode layer and the second electrode;
- a passivation layer formed on the second electrode layer, the insulation layer, and the via while opening a part of the second electrode layer;
- and
- a surface treatment layer formed on the open surface of the second electrode layer,
- wherein the second electrode layer and the via are integrally formed, and the via is directly connected to the first electrode layer without another seed layer while forming a depression space on a upper side of the via, and
- wherein the depression space is filled with the passivation layer.
8 more elements
Dependencies are inferred from the claim text.