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US 12,402,240 B2Granted
Silicon carbide thermal bridge integrated on a low thermal conductivity substrate and processes implementing the same
AssigneeWolfspeed, Inc.
InventorsHaedong Jang, Marvin Marbell, Jeremy Fisher
Life of this patent
Estimating the term…
Abstract
A component includes a substrate board; a thermal bridge structured and arranged on the substrate board, where the thermal bridge is configured to transfer heat from the substrate board including an area adjacent to or on a hotspot of the substrate board; where the thermal bridge is configured to transfer the heat to another location on the substrate board for removal of the heat from the substrate board; and where the thermal bridge may include silicon carbide.
Claims24
A component comprising:
- a substrate board;
- a thermal bridge structured and arranged on the substrate board;
- and a first trace on the substrate board,
- a first grounded trace on the substrate board,
- at least one first via in the substrate board,
- and a circuit component on the substrate board,
- wherein the thermal bridge is configured to transfer heat from the substrate board including an area adjacent to or on a hotspot of the substrate board;
- wherein the thermal bridge is configured to transfer the heat to another location on the substrate board for removal of the heat from the substrate board;
- wherein the thermal bridge comprises silicon carbide;
- wherein the thermal bridge is configured to transfer heat from the substrate board including an area adjacent the first trace;
- wherein the thermal bridge comprises a bottom metal arranged at locations adjacent the first trace and/or the at least one first via;
- and
- wherein the thermal bridge is configured to have matching thermal expansion to the circuit component on the substrate board.
10 more elements
A process of implementing a component comprising:
- providing a substrate board;
- and
- arranging a thermal bridge on the substrate board;
- and providing a first trace on the substrate board,
- a first grounded trace on the substrate board,
- at least one first via in the substrate board,
- and a circuit component on the substrate board,
- wherein the thermal bridge is configured to transfer heat from the substrate board including an area adjacent to or on a hotspot of the substrate board;
- wherein the thermal bridge is configured to transfer the heat to another location on the substrate board for removal of the heat from the substrate board;
- wherein the thermal bridge comprises silicon carbide;
- wherein the thermal bridge is configured to transfer heat from the substrate board including an area adjacent the first trace;
- wherein the thermal bridge comprises a bottom metal arranged at locations adjacent the first trace and/or the at least one first via;
- and
- wherein the thermal bridge is configured to have matching thermal expansion to the circuit component on the substrate board.
11 more elements
Dependencies are inferred from the claim text.