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US 4,964,212 AGranted
Process for producing electrical connections through a substrate
AssigneesCommissariat a l'Energie Atomique, Compagnie Europeenne de Composants Electroniques LCC
InventorsPatrice Deroux-Dauphin, Henri Sibuet, Thierry Dupeux
Life of this patent
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Abstract
According to the invention, blind holes (27) and not through-holes are produced. For this purpose, the substrate (10) to be pierced or perforated is previously covered with a layer (12) less absorbing for the laser perforating beam (26) than the substrate. Application to the production of electronic circuits, magnetic recording devices, etc.
Claims10
Process for the production of electrical connections through a substrate comprising the steps of:
- depositing at least one thin layer (12) of material on the substrate (10), the material of the at least one thin layer (12) being only slightly absorbent of a laser beam (26) such that the laser beam (26) passes through the at least one thin layer (12) without perforating the material to form an emergent beam (28) after passing therethrough;
- exposing the substrate (10) with the at least one thin layer (12) material to the laser beam (26), the laser beam (26) being at least partially absorbed by the substrate (10) to drill a hole only in the substrate (10), the laser beam (26) passing through the at least one thin layer (12) of material withous perforation thereof to form a blind hole in the substrate (10) having a bottom formed substantially by the at least one thin layer (12) of material;
- and
- forming electrical connections through the substrate (10) using the hole formed by the laser beam (26).
1 more element
Dependencies are inferred from the claim text.