Circuit board and method of fabricating the same
AssigneesHongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., China Avary Holding (Shenzhen) Co., Ltd., Garuda Technology Co., Ltd.
InventorsLi-Kun Liu, Yang Li, Chao Wang
Life of this patent
Estimating the term…
Abstract
A circuit board and a method of fabricating the same are provided. The circuit board has a connecting part and a bending part, and this circuit board includes a plurality of flexible circuit substrates electrically connected to each other and an elastic material. The flexible circuit substrate with a corrugated region is located on the bending part and is disposed on another flexible circuit substrate. A spacing is formed between those two flexible circuit substrates, while this spacing is located at the bending part. The elastic material is located at one of the flexible circuit substrates and located inside the spacing, and the elastic material is located inside a trough of the corrugated region.
Claims17
A circuit board having a bending part and at least one connecting part, comprising:
- a first flexible circuit substrate comprises:
- a corrugated region, located at the bending part of the circuit board;
- at least a second flexible circuit substrate, electrically connected to the first flexible circuit substrate disposed on the second flexible circuit substrate,
- wherein a spacing is formed between the first flexible circuit substrate and the second flexible circuit substrate, and the spacing is located at the bending part;
- and
- an elastic material, disposed on the second flexible circuit substrate and located inside the spacing,
- wherein the elastic material is located inside a trough of the corrugated region.
A method for fabricating a circuit board, comprising:
- providing a first flexible circuit substrate;
- bending a first region of the first flexible circuit substrate to form a corrugated region;
- providing two second flexible circuit substrates;
- disposing a plurality of elastic materials on a second region of each of the second flexible circuit substrates;
- providing four third circuit substrates;
- disposing the third circuit substrates on the first flexible circuit substrate, so that one edge of the first flexible circuit substrate is located between two of the third circuit substrates, and the other edge of the first flexible circuit substrate is located between the other two of the third circuit substrates,
- wherein the third circuit substrates expose the corrugated region of the first flexible circuit substrate;
- and
- disposing the second flexible circuit substrates on the third circuit substrates after the elastic materials are disposed on the second region of each of the second flexible circuit substrates, so that the first flexible circuit substrate and the third circuit substrate are located between two second flexible circuit substrates,
- wherein the corrugated region of the first flexible circuit substrate overlaps the second regions of the second flexible circuit substrates, and the elastic materials are located between the second flexible circuit substrates,
- wherein the elastic materials are located inside a plurality of troughs of the corrugated region separately.
Dependencies are inferred from the claim text.