H05K 2201/0323
Carbon
H05K2201/0323 (Carbon) appears on 686 US grants and 806 published applications in this corpus.
Search patents in H05K- Granted patents
- 686
- Published applications
- 806
- Assignees
- 453
- Inventors
- 1,818
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 12 | 0 |
| 1987 | 7 | 0 |
| 1988 | 4 | 0 |
| 1989 | 8 | 0 |
| 1990 | 7 | 0 |
| 1991 | 5 | 0 |
| 1992 | 9 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 9 | 0 |
| 1996 | 7 | 0 |
| 1997 | 6 | 0 |
| 1998 | 7 | 0 |
| 1999 | 9 | 0 |
| 2000 | 5 | 0 |
| 2001 | 10 | 2 |
| 2002 | 7 | 11 |
| 2003 | 12 | 8 |
| 2004 | 11 | 19 |
| 2005 | 4 | 12 |
| 2006 | 10 | 23 |
| 2007 | 17 | 22 |
| 2008 | 7 | 23 |
| 2009 | 12 | 60 |
| 2010 | 16 | 42 |
| 2011 | 16 | 34 |
| 2012 | 37 | 38 |
| 2013 | 19 | 35 |
| 2014 | 24 | 27 |
| 2015 | 23 | 55 |
| 2016 | 34 | 51 |
| 2017 | 43 | 44 |
| 2018 | 37 | 42 |
| 2019 | 47 | 52 |
| 2020 | 30 | 45 |
| 2021 | 37 | 36 |
| 2022 | 29 | 33 |
| 2023 | 26 | 26 |
| 2024 | 28 | 27 |
| 2025 | 21 | 24 |
| 2026 | 12 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic component and method of manufacturing the same29 Sep 2026US 12,750,954 B2Murata Manufacturing Co., Ltd.
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Insulating circuit board and semiconductor device using same25 Aug 2026US 12,721,197 B2Niterra Materials Co., Ltd.
- Micro light-emitting package11 Aug 2026US 12,707,562 B2Ennostar Corporation
- Transparent circuit board9 Jun 2026US 12,652,761 B2Avary Holding (Shenzhen) Co., Limited.
- Electrochemical biosensors and method of preparing electrochemical biosensors27 Aug 2026US 2026/0251608 A1Glc Medical (Glcm) Inc.
- Printed circuit board and manufacturing method thereof27 Aug 2026US 2026/0255479 A1Samsung Electro-Mechanics Co., Ltd.
- Carbon-based direct plating process13 Aug 2026US 2026/0234828 A1
- Integrated system for textile hybrid electronics via laser hybrid manufacturing9 Jul 2026US 2026/0197947 A1Zhejiang University
- Printed circuit board with healable features25 Jun 2026US 2026/0181767 A1SanDisk Technologies LLC
Most cited
By later US patents
- Methods of making garments having stretchable and conductive ink191US 8,945,328 B2L.I.F.E. Corporation S.A. · 2015
- Printed wiring board having highly reliably via hole and process for forming via hole129US 6,280,641 B1Mitsubishi Gas Chemical Company, Inc. · 2001
- Additive adhesive based process for the manufacture of printed circuit boards127US 4,581,301 A1986
- Membrane switch124US 4,607,147 AAlps Electric Co., Ltd. · 1986
- Composite heat transfer means105US 4,849,858 AWestinghouse Electric Corp. · 1989