Integrated circuit chip packaging including a heat sink topped cavity
AssigneeInternational Business Machines Corporation
InventorYoung Hoon Kwark
Life of this patent
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Abstract
An electrical circuit device includes a circuit board including a cavity extending from a top surface of the circuit board to an embedded conductor, an integrated circuit chip in the cavity, an electrical connection between the integrated circuit chip and the embedded conductor, a thermal slug disposed over a top surface of the integrated circuit chip, and a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the circuit board, the heat sink extending above a top surface of the circuit board.
Claims20
An electrical circuit device, comprising:
- a printed circuit board including a cavity extending from a top surface of the printed circuit hoard to an embedded conductor;
- an integrated circuit chip disposed in said cavity;
- an electrical connection between said integrated circuit chip and said embedded conductor;
- a thermal slug disposed over a top surface of said integrated circuit chip;
- and
- a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the printed circuit board.
An electrical circuit device, comprising:
- an insulating layer;
- a plurality of conductors embedded in the insulating layer;
- a cavity extending from a surface of the insulating layer to a top surface of each of the plurality of conductors such that the top surface of said each of the plurality of conductors is exposed in the cavity;
- an integrated circuit chip disposed in the cavity;
- and
- a plurality of connectors disposed in the cavity to electrically connect at least the top surface of a top conductor of the plurality of connectors and the top surface of a bottom conductor of the plurality of connectors to a top surface of the integrated circuit chip,
- wherein the top surface of the integrated circuit chip is substantially co-planar with the top surface of the bottom conductor of the plurality of connectors such that the insulating layer is disposed on a side surface of the integrated circuit chip.
An electrical circuit device, comprising:
- an insulating layer;
- a conductor embedded in the insulating layer;
- a cavity extending from a surface of the insulating layer to the conductor;
- an integrated circuit chip disposed in the cavity;
- and
- a thermal slug disposed over a top surface of the integrated circuit chip for transferring a thermal energy away from the insulating layer.
Dependencies are inferred from the claim text.