Module substrate and semiconductor module including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSunki Yun, Kwangkyu Bang, Jihong Kim, Eunji Yu, Kyungjae Kim, Yusuf Cinar
Life of this patent
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Abstract
A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.
Claims20
A device comprising:
- a substrate including a peripheral region;
- a semiconductor device on the substrate;
- a plurality of passive devices on the substrate;
- at least one first terminal in the peripheral region of the substrate;
- and
- at least one second terminal in the peripheral region of the substrate,
- wherein the peripheral region of the substrate includes at least one via hole that penetrates the substrate, and at least one groove on a sidewall of the peripheral region of the substrate,
- each of the at least one first terminal is on an inner wall of a corresponding via hole among the at least one via hole, and
- each of the at least one second terminal is exposed through a sidewall of a corresponding groove among the at least one groove.
A device comprising:
- a substrate including a peripheral region;
- a semiconductor device on the substrate;
- a plurality of passive devices on the substrate;
- a first terminal in the peripheral region of the substrate;
- and
- a second terminal in the peripheral region of the substrate,
- wherein the peripheral region of the substrate includes a via hole that penetrates the substrate, and a groove on a sidewall of the peripheral region of the substrate,
- the first terminal is on an inner wall of the via hole, and
- the second terminal is in the substrate, and includes a contact pad exposed through a sidewall of the groove.
A device comprising:
- a substrate including a peripheral region;
- a semiconductor device on the substrate, and including a solid state drive (SSD) controller, a nonvolatile memory, and a buffer memory;
- a plurality of passive devices on the substrate;
- a first terminal in the peripheral region of the substrate;
- and
- a second terminal in the peripheral region of the substrate,
- wherein the peripheral region of the substrate includes a via hole that penetrates the substrate, and a groove on a sidewall of the peripheral region of the substrate and having a partial-cylinder-shape,
- the first terminal is on an inner wall of the via hole,
- the second terminal is in the substrate, and includes a first contact pad exposed through a sidewall of the groove, and
- each of the first terminal and the second terminal is a test terminal for electrically testing the semiconductor device, and is electrically connected to the semiconductor device.
Dependencies are inferred from the claim text.