H05K 2201/09154
Bevelled, chamferred or tapered edge
H05K2201/09154 (Bevelled, chamferred or tapered edge) appears on 236 US grants and 242 published applications in this corpus.
Search patents in H05K- Granted patents
- 236
- Published applications
- 242
- Assignees
- 169
- Inventors
- 609
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 2 | 1 |
| 2002 | 9 | 3 |
| 2003 | 1 | 5 |
| 2004 | 7 | 8 |
| 2005 | 5 | 11 |
| 2006 | 8 | 7 |
| 2007 | 6 | 7 |
| 2008 | 5 | 8 |
| 2009 | 3 | 3 |
| 2010 | 5 | 11 |
| 2011 | 6 | 5 |
| 2012 | 5 | 8 |
| 2013 | 7 | 7 |
| 2014 | 7 | 12 |
| 2015 | 8 | 27 |
| 2016 | 19 | 8 |
| 2017 | 13 | 8 |
| 2018 | 10 | 9 |
| 2019 | 11 | 15 |
| 2020 | 17 | 17 |
| 2021 | 5 | 12 |
| 2022 | 13 | 10 |
| 2023 | 7 | 11 |
| 2024 | 9 | 11 |
| 2025 | 10 | 10 |
| 2026 | 4 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board and manufacturing method therefor28 Jul 2026US 12,696,385 B2Toppan Holdings Inc.
- Circuit board having an edge containing conductive regions2 Jun 2026US 12,648,082 B2Teradyne, Inc.
- Semiconductor module26 May 2026US 12,642,102 B2Samsung Electronics Co., Ltd.
- Semiconductor package with guide pin13 Jan 2026US 12,525,519 B2Semiconductor Components Industries, LLC
- Circuit board11 Nov 2025US 12,471,214 B2AUO Corporation
- Hybrid circuit board23 Jul 2026US 2026/0214793 A1Tong Hsing Electronic Industries, Ltd.
- Circuit board23 Jul 2026US 2026/0215310 A1LG Innotek Co., Ltd.
- Transition from a thin film to a thick film in electrically conducting devices16 Jul 2026US 2026/0206131 A1Dyconex AG
- Component Carrier with Different Line Spacing in Metal Traces, and Manufacture Method9 Jul 2026US 2026/0197938 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for manufacturing wiring board, and wiring board11 Jun 2026US 2026/0164562 A1Disco Corporation
Most cited
By later US patents
- Miniature multiple conductor electrical connector126US 5,071,363 AMinnesota Mining and Manufacturing Company · 1991
- Surface mount type package unit and method for manufacturing the same91US 5,901,046 ADenso Corporation · 1999
- Three-dimensional interconnect system57US 6,501,663 B1Hewlett-Packard Company · 2002
- Miniature multiple conductor electrical connector50US 5,176,530 AMinnesota Mining and Manufacturing Company · 1993
- High density printed circuit board and edge connector assembly47US 4,095,866 ANCR Corporation · 1978