Method for manufacturing wiring board, and wiring board
AssigneeDisco Corporation
InventorKen IKIGAKI
Life of this patent
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Abstract
A novel technique is provided for reducing the defect rate of a wiring board in which a laminate is formed on a core substrate. A method for manufacturing a wiring board in which a laminate is formed on a first surface side and/or a second surface side of a core substrate, the method comprising at least: forming a first processing groove having a substantially V-shaped cross-section by cutting along a division line from the first surface side by using a cutting blade; forming a second processing groove having a substantially V-shaped cross-section by cutting along the division line from the second surface side by using a cutting blade; and dividing the core substrate along the first processing groove and the second processing groove, thereby forming individual wiring boards.
Claims10
A method for manufacturing a wiring board in which a laminate is formed on a first surface side and/or a second surface side of a core substrate, the method comprising at least:
- forming a first processing groove having a substantially V-shaped cross-section by cutting along a division line from the first surface side by using a cutting blade;
- forming a second processing groove having a substantially V-shaped cross-section by cutting along the division line from the second surface side by using a cutting blade;
- and
- dividing the core substrate along the first processing groove and the second processing groove, thereby forming individual wiring boards.
A wiring board in which a laminate is formed on a first surface side and/or a second surface side of a core substrate, wherein a chamfered portion is formed so as to continuously chamfer a part of an end face of the laminate and a part of an end face of the core substrate, from a surface of the laminate formed on the first surface side and/or the second surface side to the end face of the core substrate.
A wiring board in which a laminate is formed on a first surface side and/or a second surface side of a core substrate, wherein a chamfered portion is formed so as to continuously chamfer a part of an end face of the laminate, from a surface of the laminate formed on the first surface side and/or the second surface side to the end face of the core substrate.
Dependencies are inferred from the claim text.