Surface mount type package unit and method for manufacturing the same

A method for manufacturing a surface mount type package unit including a package body directly mounted on a circuit board through solder, the method comprising steps of:

• forming a signal electrode on a mounted surface of the package body;
• forming a dummy electrode on the mounted surface of the package body to be in a non-contacting state with respect to the signal electrode;
• chamfering a verge portion of the mounted surface to form a chamfered portion;
• forming an auxiliary electrode on the chamfered portion to contact the signal electrode;
• preparing the circuit board having a conductive member on a surface thereof;
• and
• bonding the signal electrode, the dummy electrode and the auxiliary electrode of the package body to the conductive member of the circuit board by fused solder.

A surface mount type package unit comprising:

• a circuit board;
• first and second conductive members provided on the circuit board;
• a package body mounted on the circuit board via the first and second conductive members, the package body having a mounted surface facing the circuit board and a secondary surface adjacent to the mounted surface, the secondary surface being non-parallel to the mounted surface;
• a circuit element held on the package body;
• a signal electrode provided on the mounted surface of the package body to face the first conductive member of the circuit board, and electrically connected to the circuit element;
• a first solder portion provided between the signal electrode and the first conductive member to make contact between the signal electrode and the first conductive member;
• an auxiliary electrode provided on the secondary surface of the package body to face the first conductive member, and integrally connected to the signal electrode;
• a auxiliary solder portion provided between the auxiliary electrode and the first conductive member, and integrally connected to the first solder portion;
• a dummy electrode provided on the mounted surface of the package body to face the second conductive member of the circuit board, and electrically insulated from the signal electrode and the first conductive member;
• and
• a second solder portion provided between the dummy electrode and the second conductive member.