High density printed circuit board and edge connector assembly

A multilayer printed circuit board and edge connector assembly comprising:

• a multilayer printed circuit board having inner and outer layers and printed circuit patterns associated with said layers;
• first and second parallel rows of terminals located on one outer layer and adjacent one edge of said board and coplanar with the printed circuit pattern associated with said one outer layer, said second row spaced back from said edge further than said first row and connected to the printed circuit pattern associated with said one outer layer;
• connections to said first row of terminals consisting of conductive plated-through holes extending from the inner layers of said board and interconnecting the printed circuit patterns associated with said inner layers to terminals in said first row;
• an edge type circuit board connector, including a housing for receiving and positioning said board, a first set of elongated resilient contacts deflectable by the insertion of said board for engagement with said first row of terminals, and a second set of elongated resilient contacts overlying and insulated from said first set of contacts and also deflectable by the insertion of said board for engagement with said second row of terminals, said second set of contacts being substantially longer and requiring less initial force for deflection than said first set of contacts whereby the insertion and removal force for said board is not excessive.