Semiconductor module
AssigneeSamsung Electronics Co., Ltd.
InventorsJong-Hyun Seok, Dan-Kyu Kang, Hwanwook Park, Kang-Gyu Lee, Jeonghyeon Cho
Life of this patent
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Abstract
A semiconductor module includes a board including a chip area and a tab area sequentially arranged in a first direction, a semiconductor chip provided on the chip area, a plurality of signal tabs provided on the tab area, and at least one anti-static portion having conductivity, provided in the tab area, and spaced apart from the plurality of signal tabs, where the plurality of signal tabs and the at least one anti-static portion are sequentially arranged in the first direction and the at least one anti-static portion is disposed on a line extending from at least one of the plurality of signal tabs in the first direction.
Claims20
A semiconductor module comprising:
- a board comprising a chip area and a tab area sequentially arranged in a first direction;
- a semiconductor chip provided on the chip area;
- a plurality of signal tabs provided on the tab area and configured to transmit an electrical signal to or receive an electrical signal from the semiconductor chip;
- and
- at least one anti-static portion having conductivity, the at least one anti-static portion being provided in the tab area and spaced apart from the plurality of signal tabs,
- wherein the plurality of signal tabs and the at least one anti-static portion are sequentially arranged in the first direction, and
- wherein the at least one anti-static portion is disposed on a line extending from at least one of the plurality of signal tabs in the first direction.
A semiconductor module comprising:
- a board comprising:
- a chip area and a tab area sequentially arranged in a first direction, and
- at least one notch or at least one protrusion in the tab area;
- a semiconductor chip provided on the chip area;
- a plurality of signal tabs provided on the tab area and configured to transmit an electrical signal to or receive an electrical signal from the semiconductor chip;
- and
- an anti-static portion having conductivity, the anti-static portion being provided in the tab area, and spaced apart from the plurality of signal tabs,
- wherein the anti-static portion is provided either adjacent to the at least one notch or on the at least one protrusion.
A semiconductor module configured to be inserted into a socket in a first direction, the semiconductor module comprising:
- a board comprising a chip area and a tab area sequentially arranged in the first direction;
- a semiconductor chip provided on the chip area;
- a plurality of signal tabs provided on the tab area;
- and
- an anti-static portion having conductivity, the anti-static portion being provided in the tab area and spaced apart from the plurality of signal tabs,
- wherein the plurality of signal tabs and the anti-static portion are sequentially arranged in the first direction, and
- wherein the anti-static portion and the plurality of signal tabs are configured to sequentially contact a connection pin inside the socket upon insertion of the semiconductor module into the socket.
Dependencies are inferred from the claim text.