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US 12,525,519 B2Granted
Semiconductor package with guide pin
AssigneeSemiconductor Components Industries, LLC
InventorsChee Hiong Chew, Yushuang Yao, Atapol Prajuckamol, Chuncao Niu
Life of this patent
Estimating the term…
Abstract
A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.
Claims20
A semiconductor package, comprising:
- one or more substrates coupled together;
- one or more pressfit pins coupled to the one or more substrates;
- and
- two or more guide pins coupled on a first side of the one or more substrates;
- wherein each of the two or more guide pins comprises a stress relief portion;
- and
- wherein the two or more guide pins have a height greater than the one or more pressfit pins.
4 more elements
A semiconductor package, comprising:
- one or more substrates coupled together;
- one or more pressfit pins coupled to the one or more substrates;
- and
- two or more guide pins coupled to the one or more substrates;
- wherein the two or more guide pins have a height greater than the one or more pressfit pins;
- wherein each guide pin comprises a stress relief portion;
- and
- wherein the two or more guide pins are configured to align the one or more pressfit pins with corresponding openings in a printed circuit board.
5 more elements
A semiconductor package, comprising:
- a plurality of substrates coupled together;
- a plurality of pressfit pins coupled to each substrate of the plurality of substrates;
- and
- a plurality of guide pins coupled to each substrate of the plurality of substrates;
- wherein each guide pin comprises a stress relief portion;
- and
- wherein the plurality of guide pins are configured to align the plurality of pressfit pins with corresponding openings in a printed circuit board.
4 more elements
Dependencies are inferred from the claim text.