US 5,069,626 A · Plated plastic castellated interconnect for electrical components

Abstract

A plated plastic castellated interconnect comprises a substrate made from a molded polymeric material and having top and bottom surfaces with a plurality of separate mutually spaced apart castellations integrally molded to the substrate and projecting from the bottom surface of the substrate. A plurality of separate spaced apart recessed regions may be molded in an edge of the substrate and aligned with the castellations. A plurality of metal conductors are plated to the substrate as separate conductive circuit traces, so that each circuit trace extends continuously from the top surface, along the surface of a corresponding recess and to a common plane on a respective castellation at the bottom of the substrate. The plated metal castellations are arranged for soldering or gluing to contacts on a printed circuit board for electrical connection to an electrical component such as an IC chip connected to the circuit traces on the substrate. The plated plastic castellations on one component provide high lead pitch densities, complex configurations, and compliancy of electrical connections to a second electrical component, as well as other advantages.

Claims26

Dependent claims

A plated plastic castellated electrical interconnect comprising:

a substrate made from a molded polymeric material and comprising first and second principal surfaces substantially parallel to each other;
a plurality of separate, mutually spaced apart and individually compliant castellations integrally molded to the polymeric substrate and projecting from the second surface thereof to a substantially common plane spaced from the second surface, in which the individual castellations are compliant, on a microscopic level, so that the individual castellations are able to flex in three mutually orthogonal directions and thereby compensate for thermal expansion during use;
and
a plurality of electrically separated metal conductors plated to the substrate by metal plating techniques, the substrate including spaced apart recessed regions extending between the first and second surfaces, and in which the castellations are aligned with corresponding recessed regions, each of the plated conductors extending continuously from the first surface, along a corresponding recessed region, to the common plane on a corresponding one of the castellations, the plated metal conductors being adapted for electrical connection to a first electrical component adjacent the first surface of the substrate and the conductors being arranged on the castellations for electrical connection to a second electrical component adjacent the second surface of the substrate.

1 more element

A plated plastic castellated electrical interconnect for surface connection of an electrical component to a support base, comprising:

a substrate made from a molded polymeric material and comprising first and second surfaces substantially parallel to each other;
a plurality of separate mutually spaced apart castellations integrally molded to the substrate and projecting from the second surface thereof to a substantially common plane spaced from the second surface, in which the individual castellations are compliant, on a microscopic level, so that the individual castellations are able to flex in three mutually orthogonal directions and thereby compensate for thermal expansion during use;
and
a plurality of electrically separated metal conductors plated to the substrate, each of the conductors extending continuously from the first surface, around or through the substrate, to the common plane on a corresponding one of the castellations, the conductors being arranged on the castellations for surface connection to a support base and for electrical connection to an electrical component carried by the substrate and electrically connected to the conductors on the first surface of the substrate;
in which the substrate includes spaced apart recessed regions molded in the side edge of the substrate, and the castellations are aligned with corresponding recessed regions;
and the plated conductors extend along a corresponding recessed region to the surface of a corresponding castellation;
and
in which the spaced apart recessed regions comprise alternating first and second rows of recessed surfaces spaced apart along a portion of the substrate, in which the first recessed surfaces are aligned along a first axis and the second recessed surfaces are aligned along a second axis spaced from and extending substantially parallel to the first axis;
and including separate rows of first and second castellations molded to the second surface and positioned adjacent to corresponding first and second recessed surfaces that the separate conductors extend from the first surface, along the first and second recessed surfaces and then to said common plane on the first and second rows of castellations, for thereby increasing the lead count of the integrated circuit carrier.

6 more elements

A plated plastic castellated electrical interconnect comprising:

a substrate made from a molded polymeric material and having first and second surfaces substantially parallel to each other, a plurality of separate mutually spaced apart castellations integrally molded to the substrate and projecting from the second surface thereof to a substantially common plane spaced from the second surface, and a plurality of separate spaced apart recessed regions molded in the substrate and aligned with the castellations and extending from the first surface to the second surface of the substrate, in which the individual castellations are compliant, on a microscopic level, so that the individual castellations are able to flex in three mutually orthogonal directions and thereby compensate for thermal expansion during use;
the substrate having a plurality of electrically separated metal conductors plated thereon, each of the conductors extending continuously from the first surface, along a surface of the recess and to the common plane on a corresponding one of the castellations;
in which the spaced apart recessed regions comprise alternating first and second recessed surfaces spaced apart along a portion of the substrate, in which the first recessed surfaces are aligned along a first axis and the second recessed surfaces are aligned along a second axis spaced inwardly from and extending substantially parallel to the first axis, and including separate rows of first castellations and second castellations positioned adjacent to corresponding first and second recessed surfaces along corresponding substantially parallel first and second axes, the separate plated conductors extending from the first surface, along the first and second recessed surfaces, and to the first and second castellations, to thereby increase the lead density of the integrated circuit carrier.

Dependencies are inferred from the claim text.

Plated plastic castellated interconnect for electrical components

Life of this patent

Plated plastic castellated interconnect for electrical components

Life of this patent

Abstract

Claims26