H05K 2201/0919
Exposing inner circuit layers or metal planes at the side edge of
Official title: Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
H05K2201/0919 (Exposing inner circuit layers or metal planes at the side edge of) appears on 329 US grants and 298 published applications in this corpus.
Search patents in H05K- Granted patents
- 329
- Published applications
- 298
- Assignees
- 201
- Inventors
- 768
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 2 | 0 |
| 1992 | 5 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 8 | 0 |
| 1999 | 5 | 0 |
| 2000 | 9 | 0 |
| 2001 | 5 | 3 |
| 2002 | 14 | 12 |
| 2003 | 5 | 9 |
| 2004 | 11 | 13 |
| 2005 | 9 | 12 |
| 2006 | 6 | 22 |
| 2007 | 12 | 18 |
| 2008 | 10 | 16 |
| 2009 | 10 | 12 |
| 2010 | 11 | 13 |
| 2011 | 10 | 8 |
| 2012 | 19 | 7 |
| 2013 | 3 | 6 |
| 2014 | 4 | 10 |
| 2015 | 7 | 16 |
| 2016 | 12 | 18 |
| 2017 | 18 | 11 |
| 2018 | 13 | 8 |
| 2019 | 12 | 8 |
| 2020 | 13 | 17 |
| 2021 | 14 | 17 |
| 2022 | 12 | 8 |
| 2023 | 9 | 13 |
| 2024 | 7 | 8 |
| 2025 | 12 | 4 |
| 2026 | 1 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor module26 May 2026US 12,642,102 B2Samsung Electronics Co., Ltd.
- Electronic component25 Nov 2025US 12,482,713 B2Murata Manufacturing Co., Ltd.
- Assembly and harness assembly25 Nov 2025US 12,482,973 B2Japan Aviation Electronics Industry, Limited
- Interfaces for coupling a memory module to a circuit board, and associated devices, modules, and systems14 Oct 2025US 12,446,174 B2Micron Technology, Inc.
- Sidewall plating of circuit boards for layer transition connections5 Aug 2025US 12,382,581 B2International Business Machines Corporation
- Component Carrier With Vertically Connected Cavity Sub-Portions30 Jul 2026US 2026/0223704 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Led module having through channels and conforming to certification standards of dci and display screen18 Jun 2026US 2026/0173590 A1Nanjing Lopu Co., Ltd.
- Protection circuit module and battery pack21 May 2026US 2026/0142355 A1Samsung SDI.Co., Ltd.
- Wiring board, electronic component mounting package including wiring board, and electronic module14 May 2026US 2026/0136464 A1KYOCERA Corporation
- Hearing aid with hearing aid module, and hearing aid module and method for manufacturing the same23 Apr 2026US 2026/0113580 A1Sivantos Pte.Ltd
Most cited
By later US patents
- Liquid crystal display device assembled by flip chip technology comprising a folded multi-layered flexible driving circuit substrate120US 5,838,412 AHitachi Device Engineering Co., Ltd. · 1998
- Printed circuit board interconnection88US 5,219,292 AMotorola, Inc. · 1993
- Method of manufacturing shielded electronic circuit units78US 7,478,474 B2Alps Electric Co., Ltd. · 2009
- Advanced polymers on metal printed wiring board70US 4,963,697 ATexas Instruments Incorporated · 1990
- Ceramic/organic multilayer interconnection board66US 4,740,414 ARockwell International Corporation · 1988