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US 12,446,174 B2Granted
Interfaces for coupling a memory module to a circuit board, and associated devices, modules, and systems
AssigneeMicron Technology, Inc.
InventorAnthony D. Veches
Life of this patent
Estimating the term…
Abstract
This disclosure relates generally to interfaces between memory modules and circuit boards. More specifically, this disclosure relates to interfaces for coupling a memory module to a circuit board such that the memory module is arranged in a plane that is substantially parallel with a plane of the circuit board. Various embodiments disclosed herein include interfaces, memory modules including interfaces or portions of interfaces, and/or circuit boards including interfaces and/or portions of interfaces. Associated devices and systems are also disclosed.
Claims13
A device comprising:
- a server comprising:
- a card comprising:
- a circuit board, a first major surface of the circuit board substantially in a first plane and a first side surface of the circuit board at least substantially perpendicular to the first major surface of the circuit board;
- and
- a memory module electrically coupled to the circuit board, a second major surface of the memory module in a second plane, the second plane substantially parallel to the first plane and a second side surface of the memory module at least substantially perpendicular to the second major surface of the memory module and in contact with the first side surface of the circuit board.
2 more elements
A device, comprising:
- a circuit board, a first major surface of the circuit board in a first plane, a processor on the first major surface of the circuit board and a first side surface of the circuit board at least substantially perpendicular to the first major surface of the circuit board;
- and
- a memory module electrically coupled to the circuit board via first electrically conductive lines, a second major surface of the memory module in a second plane parallel to the first plane, and a portion of the memory module extending in a direction at least substantially parallel to the first plane and a second side surface of the memory module at least substantially perpendicular to the second major surface of the memory module and in contact with the first side surface of the circuit board.
Dependencies are inferred from the claim text.